Method of producing a backing structure for an ultrasound transceiver
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United States of America Patent
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-
Jul 31, 2001
Grant Date -
N/A
app pub date -
Feb 17, 1998
filing date -
Feb 17, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of producing an acoustically absorbing anisotropic backing structure for an ultrasound transceiver is disclosed. Laser machining of a substrate of acoustically absorbent electrically resistive material produces a set of vias and indented pad seats. The machined substrate is plated with an electrically conductive material. Excess electrically conductive material is removed from the substrate to leave an electrically conductive material plating on the indented pad seats and the vias to form conductive pads and plated vias on the substrate.
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