Methods of making microelectronic components having electrophoretically deposited layers
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United States of America Patent
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Jul 31, 2001
Grant Date -
N/A
app pub date -
Jul 17, 1998
filing date -
Jul 19, 1994
priority date (Note) -
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status (Latency Note)
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Abstract
A method of making a microelectronic component by providing a conductive element, providing a resist at selected locations on said conductive element and electrophoretically depositing an uncured dielectric material on the conductive element, wherein the uncured material will be deposited on the conductive element except at locations covered by the resist. The deposited material is cured to form a dielectric layer and the resist is removed so that the dielectric layer has openings extending to the conductive element at locations the locations which were covered by the resist.
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