Highly reliable thermoelectric cooling apparatus and method
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United States of America Patent
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Jul 31, 2001
Grant Date -
N/A
app pub date -
Oct 7, 1999
filing date -
Oct 7, 1999
priority date (Note) -
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Abstract
Apparatus, method, and signal for sub-ambient cooling using thermoelectric dynamics in conjunction with configurations and activation schemes to maximize the mean time between failure (MTBF) of thermoelectric coolers. In one form, a signal is provided which periodically alters the state of the Peltier devices from an active state to a passive state. During the active state the Peltier device provides maximum cooling and during the passive state the Peltier device minimizes thermal leakage while reducing cooling. Preferable implementations provide multiple signals to thermoelectric arrays such that, for a predetermined time, a first set of the arrays are in the active state while a second set of the arrays are in the passive state to thereby minimize failures and maximize the MTBF of the thermoelectric arrays.
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