Method and apparatus for application of adhesive tape to semiconductor devices
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United States of America Patent
Stats
-
Jul 31, 2001
Grant Date -
N/A
app pub date -
Jun 14, 1999
filing date -
Aug 7, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A first adhesively coated tape material length is supplied to a first die associated with a cutting and application mechanism. A second length of adhesively coated tape material is also provided to a second die of the cutting and application mechanism. A plurality of LOC leadframes is supplied sequentially through the application structure to apply a first decal cut from the first tape material to a first die site at a first location and to apply a second decal cut from the second tape material to a second die site at a second location.
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