Fixed abrasive finishing element having aids finishing method
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United States of America Patent
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-
Jul 31, 2001
Grant Date -
N/A
app pub date -
Nov 5, 1999
filing date -
Nov 6, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of using a finishing element having a fixed abrasive finishing surface including boundary lubricants for finishing semiconductor wafers is described. The lubricants in the finishing element are transferred to operative finishing interface a forming lubricating boundary layer. The lubricating boundary layer thickness is controlled to improve finishing and reduce unwanted surface defects. Differential lubricating boundary layer methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing.
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