Method of manufacture of an inverted radial back-curling thermoelastic ink jet
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United States of America Patent
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-
Jul 31, 2001
Grant Date -
N/A
app pub date -
Jul 10, 1998
filing date -
Jul 15, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of manufacturing an ink jet printhead which comprises the step of providing an initial semiconductor wafer having an electrical circuitry layer formed thereon. The circuitry layer is etched to define a nozzle cavity area. A first material layer is deposited and etched for vias through the first material layer for electrical interconnection of subsequently deposited layers with the circuitry layer. A conductive material layer is deposited on the first material layer and etched to form a heater pattern. A second material layer having a high coefficient of thermal expansion is deposited on the conductive material layer. The second material layer is etched to define an ink ejection port. The wafer is etched to define a nozzle chamber. An ink supply channel is etched through the wafer to be in fluid communication with the nozzle chamber.
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