Method of making and using lithographic contact springs
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United States of America Patent
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-
Jul 31, 2001
Grant Date -
N/A
app pub date -
Dec 2, 1998
filing date -
Dec 2, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.
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