Fabrication method for integrated passive component
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United States of America Patent
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Jul 31, 2001
Grant Date -
N/A
app pub date -
Jul 15, 1999
filing date -
Jul 15, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to a fabrication method for integrated passive component, comprising the steps of providing an insulator substrate and then planarizing the insulator substrate; forming integrated passive components on the insulator substrate; and packaging the integrated passive components by a thick film packaging method. The advantages of the method of the invention are that the fabricated components are miniaturized, the yield is high, and cost of production is low.
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