Semiconductor laser diode multi-chip module
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United States of America Patent
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Jul 31, 2001
Grant Date -
N/A
app pub date -
Mar 4, 1999
filing date -
Mar 4, 1999
priority date (Note) -
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Abstract
A substrate comprising, for example, a copper-beryllium oxide ceramic-copper sandwich permits a laser diode along with cooperative components to be soldered in place using a high temperature solder. The sandwich structure is operative to move the effective thermal properties of the copper more towards that of the beryllium oxide thus reducing, for example, any stress which might occur between the solder, the substrate, and the laser diode. The use of high temperature solder provides for significantly improved operation.
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