Method of manufacturing semiconductor device in which semiconductor chip is mounted facedown on board
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United States of America Patent
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-
Aug 7, 2001
Grant Date -
N/A
app pub date -
Jan 6, 1999
filing date -
Jan 6, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
There is provided a method of manufacturing a semiconductor device that ensures the connection state and enhance structural stability, reliability and heat-radiation performance. In a first step, metal bumps are joined to one of electrodes on a semiconductor chip and connection pads on a board. In a second step, the semiconductor chip is adhered to join means. In a third step, join means is joined with the board for connecting the metal bumps with the electrodes or the connection pads.
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