Laser diode package with slotted lead
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United States of America Patent
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-
Aug 7, 2001
Issued Date -
N/A
app pub date -
Dec 22, 1998
filing date -
Nov 12, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A laser diode or laser diode bar mounted on a heat sink and having an insulating layer of greater thickness also mounted on the heat sink requires a lead overlying both the insulating layer and the diode to bend downward for making electrical contact. Failures have been found to occur at the bend. The provision of a pattern of slots at the bend alleviates the problem by reducing stress there. The use of such slotted leads is disclosed for diodes or diode bars individually or in a stack arrangement.
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