Mounting structure and mounting process from semiconductor devices

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United States of America Patent

PATENT NO 6274389
SERIAL NO

09341288

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Abstract

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The present invention provides a mounting structure for semiconductor devices which enables a semiconductor device, such as CSP/BGA, to be fixed to a circuit board. This invention also provides a mounting process for semiconductor devices.

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Patent Owner(s)

Patent OwnerAddress
HENKEL LOCTITE CORPORATION1001 TROUT BROOK CROSSING ROCKY HILL CT 06067

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iida, Kazutoshi Kanagawa, JP 8 128
Meguro, Takeshi Ibaraki, JP 28 225
Watanabe, Masaki Shiga, JP 291 4509
Wigham, Jon Dublin, IE 2 21

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