Method and apparatus providing redundancy for fabricating highly reliable memory modules
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United States of America Patent
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Aug 14, 2001
Issued Date -
N/A
app pub date -
Aug 31, 2000
filing date -
Oct 8, 1996
priority date (Note) -
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Abstract
A method and apparatus for repair of a multi-chip module, such as a memory module, is provided where at least one redundant or auxiliary chip attach location is provided on the substrate of the multi-chip module. The auxiliary chip attach location preferably provides contacts for attachment of more than one type of replacement semiconductor chip. Accordingly, when one or more chips on the multi-chip module are found to be completely or partially defective, at least one replacement chip can be selected and attached to the auxiliary location to provide additional memory to bring the module back to its design capacity.
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