US Patent No: 6,274,823

Number of patents in Portfolio can not be more than 2000

Interconnection substrates with resilient contact structures on both sides

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ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond. The component carries the contact structures on both sides, the spacing of the structures on the first side being different than that of the second side.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
FORMFACTOR, INC.LIVERMORE, CA440

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Khandros, Igor Y Orinda, CA 238 13648
Mathieu, Gaetan L Varennes, CA 216 9019

Cited Art

Patent Info (Count) # Cites Year
 
TEXAS INSTRUMENTS INCORPORATED (39)
4,385,202 Electronic circuit interconnection system 30 1980
4,514,750 Integrated circuit package having interconnected leads adjacent the package ends 36 1982
4,754,316 Solid state interconnection system for three dimensional integrated circuit structures 70 1982
4,472,762 Electronic circuit interconnection system 27 1982
4,546,406 Electronic circuit interconnection system 16 1984
4,673,967 Surface mounted system for leaded semiconductor devices 40 1985
4,750,089 Circuit board with a chip carrier and mounting structure connected to the chip carrier 56 1985
4,903,120 Chip carrier with interconnects on lid 27 1985
4,709,468 Method for producing an integrated circuit product having a polyimide film interconnection structure 83 1986
4,695,870 Inverted chip carrier 84 1986
4,695,872 High density micropackage for IC chips 41 1986
4,890,194 A chip carrier and mounting structure connected to the chip carrier 32 1987
5,057,461 Method of mounting integrated circuit interconnect leads releasably on film 31 1987
4,861,452 Fixture for plating tall contact bumps on integrated circuit 24 1987
4,874,722 Process of packaging a semiconductor device with reduced stress forces 35 1988
5,025,306 Assembly of semiconductor chips 125 1988
4,874,476 Fixture for plating tall contact bumps on integrated circuit 10 1988
4,931,149 Fixture and a method for plating contact bumps for integrated circuits 34 1989
4,982,264 High density integrated circuit package 9 1989
5,059,557 Method of electrically connecting integrated circuits by edge-insertion in grooved support members 22 1990
5,106,784 Method of making a post molded cavity package with internal dam bar for integrated circuit 36 1990
5,024,746 Fixture and a method for plating contact bumps for integrated circuits 69 1990
5,128,612 Disposable high performance test head 26 1990
5,136,367 Low cost erasable programmable read only memory package 18 1990
5,130,783 Flexible film semiconductor package 80 1991
5,123,850 Non-destructive burn-in test socket for integrated circuit die 239 1991
5,196,268 Integrated circuit interconnect leads releasably mounted on film 25 1991
5,201,454 Process for enhanced intermetallic growth in IC interconnections 21 1991
5,187,020 Compliant contact pad 92 1991
5,239,199 Vertical lead-on-chip package 18 1992
5,192,681 Low cost erasable programmable read only memory package 17 1992
5,338,705 Pressure differential downset 7 1992
5,327,327 Three dimensional assembly of integrated circuit chips 61 1992
5,308,797 Leads for semiconductor chip assembly and method 18 1992
5,306,670 Multi-chip integrated circuit module and method for fabrication thereof 69 1993
5,359,493 Three dimensional multi-chip module with integral heat sink 22 1993
5,321,277 Multi-chip module testing 49 1993
5,397,245 Non-destructive interconnect system for semiconductor devices 50 1993
5,432,677 Multi-chip integrated circuit module 103 1994
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (34)
4,231,154 Electronic package assembly method 52 1979
4,322,778 High performance semiconductor package assembly 148 1980
4,418,857 High melting point process for Au:Sn:80:20 brazing alloy for chip carriers 76 1980
4,407,007 Process and structure for minimizing delamination in the fabrication of multi-layer ceramic substrate 36 1981
4,447,857 Substrate with multiple type connections 75 1981
4,453,176 LSI Chip carrier with buried repairable capacitor with low inductance leads 30 1981
4,462,534 Method of bonding connecting pins to the eyelets of conductors formed on a ceramic substrate 74 1982
4,553,192 High density planar interconnected integrated circuit package 120 1983
4,545,610 Method for forming elongated solder connections between a semiconductor device and a supporting substrate 271 1983
4,548,451 Pinless connector interposer and method for making the same 142 1984
4,604,644 Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making 229 1985
4,811,082 High performance integrated circuit packaging structure 259 1986
4,764,848 Surface mounted array strain relief device 60 1986
4,796,078 Peripheral/area wire bonding technique 141 1987
4,855,867 Full panel electronic packaging structure 50 1988
4,907,734 Method of bonding gold or gold alloy wire to lead tin solder 27 1988
4,914,814 Process of fabricating a circuit package 102 1989
5,198,153 Electrically conductive polymeric 66 1989
4,970,570 Use of tapered head pin design to improve the stress distribution in the braze joint 25 1989
4,998,885 Elastomeric area array interposer 116 1989
4,975,079 Connector assembly for chip testing 85 1990
5,130,779 Solder mass having conductive encapsulating arrangement 83 1990
5,283,104 Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates 30 1991
5,118,027 Method of aligning and mounting solder balls to a substrate 103 1991
5,185,073 Method of fabricating nendritic materials 87 1991
5,200,112 Electrically conductive polymeric materials and uses thereof 23 1991
5,202,061 Electrically conductive polymeric materials and uses thereof 27 1991
5,147,084 Interconnection structure and test method 129 1991
5,239,447 Stepped electronic device package 134 1991
5,326,643 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 18 1991
5,299,939 Spring array connector 96 1992
5,337,475 Process for producing ceramic circuit structures having conductive vias 15 1992
5,288,007 Apparatus and methods for making simultaneous electrical connections 19 1992
5,386,344 Flex circuit card elastomeric cable connector assembly 23 1993
 
TESSERA, INC. (16)
5,148,266 Semiconductor chip assemblies having interposer and flexible lead 460 1990
5,148,265 Semiconductor chip assemblies with fan-in leads 488 1991
5,347,159 Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate 194 1991
5,282,312 Multi-layer circuit construction methods with customization features 136 1991
5,367,764 Method of making a multi-layer circuit assembly 78 1991
5,346,861 Semiconductor chip assemblies and methods of making same 166 1992
5,258,330 Semiconductor chip assemblies with fan-in leads 158 1993
5,414,298 Semiconductor chip assemblies and components with pressure contact 86 1993
5,390,844 Semiconductor inner lead bonding tool 69 1993
5,398,863 Shaped lead structure and method 99 1993
5,477,611 Method of forming interface between die and chip carrier 119 1993
5,455,390 Microelectronics unit mounting with multiple lead bonding 176 1994
5,489,749 Semiconductor connection components and method with releasable lead support 108 1994
5,518,964 Microelectronic mounting with multiple lead deformation and bonding 324 1994
5,491,302 Microelectronic bonding with lead motion 86 1994
5,525,545 Semiconductor chip assemblies and components with pressure contact 63 1994
 
AMP INCORPORATED (12)
4,195,193 Lead frame and chip carrier housing 57 1979
4,278,311 Surface to surface connector 34 1980
4,408,218 Ceramic chip carrier with lead frame having removable rim 28 1981
4,410,905 Power, ground and decoupling structure for chip carriers 77 1981
4,419,818 Method for manufacturing substrate with selectively trimmable resistors between signal leads and ground structure 19 1981
4,642,889 Compliant interconnection and method therefor 111 1985
5,047,830 Field emitter array integrated circuit chip interconnection 44 1990
5,173,055 Area array connector 186 1991
5,131,852 Electrical socket 56 1991
5,139,427 Planar array connector and flexible contact therefor 88 1991
5,152,695 Surface mount electrical connector 199 1991
5,228,861 High density electrical connector system 142 1992
 
FREESCALE SEMICONDUCTOR, INC. (11)
5,077,633 Grounding an ultra high density pad array chip carrier 30 1989
5,006,673 Fabrication of pad array carriers from a universal interconnect structure 106 1989
4,989,069 Semiconductor package having leads that break-away from supports 60 1990
5,024,372 Method of making high density solder bumps and a substrate socket for high density solder bumps 115 1990
5,136,366 Overmolded semiconductor package with anchoring means 73 1990
5,148,968 Solder bump stretch device 33 1991
5,217,597 Solder bump transfer method 29 1991
5,311,059 Backplane grounding for flip-chip integrated circuit 120 1992
5,535,101 Leadless integrated circuit package 197 1992
5,241,133 Leadless pad array chip carrier 173 1992
5,386,341 Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape 161 1993
 
MOTOROLA, INC. (10)
4,513,355 Metallization and bonding means and method for VLSI packages 93 1983
4,661,192 Low cost integrated circuit bonding process 152 1985
4,700,276 Ultra high density pad array chip carrier 87 1986
4,700,473 Method of making an ultra high density pad array chip carrier 96 1986
4,777,564 Leadform for use with surface mounted components 19 1987
5,012,187 Method for parallel testing of semiconductor devices 139 1989
5,045,921 Pad array carrier IC device using flexible tape 188 1989
5,029,325 TAB tape translator for use with semiconductor devices 36 1990
5,154,341 Noncollapsing multisolder interconnection 81 1990
5,134,462 Flexible film chip carrier having a flexible film substrate and means for maintaining planarity of the substrate 15 1991
 
HITACHI, LTD. (9)
4,821,148 Resin packaged semiconductor device having a protective layer made of a metal-organic matter compound 87 1986
4,739,125 Electric component part having lead terminals 12 1986
4,764,804 Semiconductor device and process for producing the same 105 1987
4,893,172 Connecting structure for electronic part and method of manufacturing the same 214 1988
5,086,337 Connecting structure of electronic part and electronic device using the structure 132 1988
5,037,023 Method and apparatus for wire bonding 27 1989
5,041,901 Lead frame and semiconductor device using the same 43 1990
5,110,032 Method and apparatus for wire bonding 37 1991
5,285,949 Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method 16 1992
 
KABUSHIKI KAISHA TOSHIBA (6)
4,597,522 Wire bonding method and device 33 1984
4,732,313 Apparatus and method for manufacturing semiconductor device 44 1985
4,807,021 Semiconductor device having stacking structure 272 1987
4,857,482 Method of forming bump electrode and electronic circuit device 33 1988
4,878,098 Semiconductor integrated circuit device 46 1989
5,448,106 Thin semiconductor integrated circuit device assembly 21 1995
 
LSI LOGIC CORPORATION (6)
5,442,282 Testing and exercising individual, unsingulated dies on a wafer 102 1992
5,453,583 Interior bond pad arrangements for alleviating thermal stresses 15 1993
5,347,162 Preformed planar structures employing embedded conductors 59 1993
5,381,848 Casting of raised bump contacts on a substrate 43 1993
5,388,327 Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package 59 1993
5,435,482 Integrated circuit having a coplanar solder ball contact array 89 1994
 
TYCO INTERNATIONAL LTD., A CORPORATION OF BERMUDA (6)
4,664,309 Chip mounting device 105 1983
4,705,205 Chip carrier mounting device 143 1984
4,955,523 Interconnection of electronic components 186 1988
5,095,187 Weakening wire supplied through a wire bonder 27 1989
5,189,507 Interconnection of electronic components 73 1991
5,221,815 Heat recoverable soldering device 23 1991
 
CIRCUIT COMPONENTS, INCORPORATED (4)
4,793,814 Electrical circuit board interconnect 254 1986
5,065,281 Molded integrated circuit package incorporating heat sink 73 1990
5,071,359 Array connector 91 1990
5,309,324 Device for interconnecting integrated circuit packages to circuit boards 86 1991
 
HUGHES AIRCRAFT COMPANY (4)
4,716,049 Compressive pedestal for microminiature connections 112 1986
4,924,353 Connector system for coupling to an integrated circuit chip 98 1988
5,007,576 Testable ribbon bonding method and wedge bonding tool for microcircuit device fabrication 48 1989
5,378,982 Test probe for panel having an overlying protective member adjacent panel contacts 15 1993
 
INTEL CORPORATION (4)
4,574,470 Semiconductor chip mounting system 32 1984
4,667,219 Semiconductor chip interface 90 1984
4,983,907 Driven guard probe card 72 1989
5,210,939 Lead grid array integrated circuit 91 1992
 
LOCKHEED MARTIN CORPORATION (4)
4,842,184 Method and apparatus for applying solder preforms 32 1988
4,884,122 Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer 92 1988
4,918,811 Multichip integrated circuit packaging method 139 1989
4,937,203 Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer 70 1989
 
MICRON TECHNOLOGY, INC. (4)
4,189,825 Integrated test and assembly device 67 1977
4,225,900 Integrated circuit device package interconnect means 70 1978
4,312,117 Integrated test and assembly device 151 1979
5,424,652 Method and apparatus for testing an unpackaged semiconductor die 129 1992
 
MITSUBISHI DENKI KABUSHIKI KAISHA (4)
4,941,033 Semiconductor integrated circuit device 70 1989
4,942,140 Method of packaging semiconductor device 79 1989
4,967,261 Tape carrier for assembling an IC chip on a substrate 59 1989
5,055,780 Probe plate used for testing a semiconductor device, and a test apparatus therefor 51 1990
 
BELL TELEPHONE LABORATORIES, INCORPORATED (3)
4,332,341 Fabrication of circuit packages using solid phase solder bonding 71 1979
4,670,770 Integrated circuit chip-and-substrate assembly 143 1984
4,595,794 Component mounting apparatus 32 1984
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (3)
4,356,374 Electronics circuit device and method of making the same 50 1980
5,014,111 Electrical contact bump and a package provided with the same 117 1988
5,316,204 Method for bonding lead with electrode of electronic device 21 1992
 
NEC CORPORATION (3)
4,874,721 Method of manufacturing a multichip package with increased adhesive strength 61 1988
5,246,159 Method for forming a bump by bonding a ball on an electrode of an electronic device and apparatus for forming the same 12 1992
5,350,947 Film carrier semiconductor device 59 1992
 
RAYTHEON COMPANY (3)
4,783,719 Test connector for electrical devices 104 1987
4,902,606 Compressive pedestal for microminiature connections 83 1988
5,339,027 Rigid-flex circuits with raised features as IC test probes 24 1993
 
STOVOKOR TECHNOLOGY LLC (3)
4,926,241 Flip substrate for chip mount 146 1988
5,289,346 Peripheral to area adapter with protective bumper for an integrated circuit chip 113 1993
5,379,191 Compact adapter package providing peripheral to area translation for an integrated circuit chip 88 1994
 
AT & T TECHNOLOGIES, INC., (2)
4,402,450 Adapting contacts for connection thereto 19 1981
4,412,642 Cast solder leads for leadless semiconductor circuits 72 1982
 
CITIZEN WATCH CO., LTD. (2)
4,237,607 Method of assembling semiconductor integrated circuit 51 1978
4,688,074 Connecting structure for a display device 23 1985
 
FUJITSU LIMITED (2)
4,703,393 Mounting structure of flat-lead package-type electronic component 16 1985
4,751,482 Semiconductor integrated circuit device having a multi-layered wiring board for ultra high speed connection 70 1986
 
GENERAL DYNAMICS INFORMATION SYSTEMS, INC. (2)
4,827,611 Compliant S-leads for chip carriers 37 1988
5,294,039 Plated compliant lead 32 1993
 
HEWLETT-PACKARD COMPANY (2)
4,956,749 Interconnect structure for integrated circuits 27 1987
5,053,922 Demountable tape-automated bonding system 46 1989
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (2)
4,954,878 Method of packaging and powering integrated circuit chips and the chip assembly formed thereby 138 1989
5,157,325 Compact, wireless apparatus for electrically testing printed circuit boards 60 1991
 
ITT CORPORATION (2)
4,634,199 Connector assembly for making multiple connections in a thin space 40 1985
4,628,410 Surface mounting connector 46 1985
 
MANIA TECHNOLOGIE BELGIUM N.V. (2)
5,109,596 Adapter arrangement for electrically connecting flat wire carriers 93 1989
5,399,982 Printed circuit board testing device with foil adapter 100 1993
 
MICRO-PROBE, INC. (2)
4,757,256 High density probe card 53 1987
4,837,622 High density probe card 93 1988
 
NATIONAL SEMICONDUCTOR CORPORATION (2)
4,649,415 Semiconductor package with tape mounted die 65 1985
4,751,199 Process of forming a compliant lead frame for array-type semiconductor packages 106 1987
 
NEC ELECTRONICS CORPORATION (2)
5,060,843 Process of forming bump on electrode of semiconductor chip and apparatus used therefor 91 1990
5,263,246 Bump forming method 23 1992
 
NORTEL NETWORKS LIMITED (2)
4,710,798 Integrated circuit chip package 120 1985
4,943,845 Thick film packages with common wafer aperture placement 8 1988
 
OLIN CORPORATION (2)
4,721,993 Interconnect tape for use in tape automated bonding 44 1986
4,816,426 Process for manufacturing plastic pin grid arrays and the product produced thereby 39 1987
 
RAYCHEM CORPORATION (2)
4,646,435 Chip carrier alignment device and alignment method 22 1985
4,903,889 Connection to a component for use in an electronics assembly 22 1989
 
SGS-THOMSON MICROELECTRONICS, INC. (2)
4,627,151 Automatic assembly of integrated circuits 57 1984
4,685,998 Process of forming integrated circuits with contact pads in a standard array 140 1986
 
SHARP KABUSHIKI KAISHA (2)
4,509,099 Electronic component with plurality of terminals thereon 67 1983
4,818,728 Method of making a hybrid semiconductor device 266 1987
 
SHIN-ETSU POLYMER CO., LTD. (2)
4,295,700 Interconnectors 86 1979
4,330,165 Press-contact type interconnectors 41 1980
 
SV PROBE PTE LTD. (2)
5,180,977 Membrane probe contact bump compliancy system 139 1991
5,422,574 Large scale protrusion membrane for semiconductor devices under test with very high pin counts 164 1993
 
TEKTRONIX, INC. (2)
4,597,617 Pressure interconnect package for integrated circuits 114 1984
4,647,959 Integrated circuit package, and method of forming an integrated circuit package 37 1985
 
UNISYS CORPORATION (2)
4,216,350 Multiple solder pre-form with non-fusible web 46 1978
4,641,176 Semiconductor package with contact springs 32 1986
 
ADVANCED INTERCONNECTIONS CORPORATION (1)
4,442,938 Socket terminal positioning method and construction 45 1983
 
ADVANCED MICRO DEVICES, INC. (1)
4,887,148 Pin grid array package structure 38 1988
 
ALLIEDSIGNAL INC. (1)
5,097,100 Noble metal plated wire and terminal assembly, and method of making the same 36 1991
 
AMERICAN TELEPHONE AND TELEGRAPH COMPANY, AT&T BELL LABORATORIES (1)
4,878,611 Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate 189 1988
 
BAHL, KENNETH S. (1)
5,083,697 Particle-enhanced joining of metal surfaces 86 1990
 
BURNDY CORPORATION (1)
4,767,344 Solder mounting of electrical contacts 97 1987
 
CANTOR JAY (1)
4,374,457 Method of fabricating complex micro-circuit boards and substrates 61 1980
 
CEPROBE CORPORATION, A DE CORP. (1)
5,382,898 High density probe card for testing electrical circuits 100 1992
 
CERPROBE CORPORATION (1)
5,066,907 Probe system for device and circuit testing 30 1990
 
COMPAQ COMPUTER CORPORATION (1)
5,214,563 Thermally reactive lead assembly and method for making same 32 1991
 
COMPUTING DEVICES INTERNATIONAL, INC. (1)
5,317,479 Plated compliant lead 50 1993
 
CTS CORPORATION (1)
4,417,392 Process of making multi-layer ceramic package 53 1981
 
E. I. DU PONT DE NEMOURS AND COMPANY (1)
4,532,152 Fabrication of a printed circuit board with metal-filled channels 81 1983
 
ELTEC INSTRUMENTS, INC. (1)
4,326,663 Pyroelectric detector 39 1980
 
GENERAL DATACOMM, INC. (1)
5,366,380 Spring biased tapered contact elements for electrical connectors and integrated circuit packages 82 1993
 
GTE AUTOMATIC ELECTRIC LABORATORIES INCORPORATED (1)
4,272,140 Arrangement for mounting dual-in-line packaged integrated circuits to thick/thin film circuits 13 1979
 
HITACHI VLSI ENGINEERING CORP. (1)
5,067,007 Semiconductor device having leads for mounting to a surface of a printed circuit board 154 1991
 
HONEYWELL INC. (1)
4,615,573 Spring finger interconnect for IC chip carrier 49 1985
 
HUGHES ELECTRONICS CORPORATION (1)
5,148,103 Apparatus for testing integrated circuits 146 1990
 
KABUSHIKI KAISHA SHINKAWA (1)
5,192,018 Wire bonding method 12 1992
 
KULICKE & SOFFA INVESTMENTS, INC. (1)
4,422,568 Method of making constant bonding wire tail lengths 24 1981
 
LG SEMICON CO., LTD. (1)
4,677,458 Ceramic IC package attachment apparatus 28 1983
 
MARTIN MARIETTA CORPORATION (1)
5,331,203 High density interconnect structure including a chamber 71 1993
 
MATSUSHITA ELECTRIC WORKS, LTD. (1)
4,868,638 Plastic molded pin grid chip carrier package 37 1987
 
MAXIM INTEGRATED PRODUCTS, INC. (1)
4,628,406 Method of packaging integrated circuit chips, and integrated circuit package 70 1985
 
MAYO FOUNDATION FOR MEDICAL EDUCATION AND RESEARCH (1)
4,551,746 Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation 103 1983
 
MEDALLION TEHNOLOGY, LLC (1)
5,045,975 Three dimensionally interconnected module assembly 40 1989
 
MESSERSCHMITT-BOLKOW-BLOHM GMBH (1)
4,784,872 Process for encapsulating microelectronic semi-conductor and layer type circuits 48 1986
 
MICRO-CIRCUITS COMPANY (1)
4,818,823 Adhesive component means for attaching electrical components to conductors 37 1987
 
MINNESOTA MINING AND MANUFACTURING COMPANY (1)
4,641,426 Surface mount compatible connector system with mechanical integrity 52 1985
 
MOTOROLA SOLUTIONS, INC. (1)
5,088,007 Compliant solder interconnection 35 1991
 
MURATA MANUFACTURING CO., LTD. (1)
4,708,885 Manufacturing method for an electronic component 12 1986
 
NANOPIERCE TECHNOLOGIES, INC. (1)
5,471,151 Electrical interconnect using particle enhanced joining of metal surfaces 54 1992
 
NCR CORPORATION (1)
4,396,935 VLSI Packaging system 58 1980
 
NIPPON STEEL CORPORATION (1)
5,227,662 Composite lead frame and semiconductor device using the same 83 1992
 
NORTEL NETWORKS CORPORATION (1)
4,814,295 Mounting of semiconductor chips on a plastic substrate 84 1986
 
NORTHROP GRUMMAN SYSTEMS CORPORATION (1)
5,237,203 Multilayer overlay interconnect for high-density packaging of circuit elements 31 1992
 
PALOMAR TECHNOLOGIES CORPORATION (1)
4,858,819 Orthogonal bonding method and equipment 14 1988
 
PALOMAR TECHNOLOGIES, INC. (1)
4,600,138 Bonding tool and clamp assembly and wire handling method 68 1984
 
RCA CORPORATION (1)
4,520,561 Method of fabricating an electronic circuit including an aperture through the substrate thereof 10 1983
 
SANYO ELECTRIC CO., LTD. (1)
4,860,433 Method of manufacturing an inductance element 29 1987
 
SCHLUMBERGER TECHNOLOGY CORPORATION (1)
4,547,833 High density electronics packaging system for hostile environment 30 1983
 
SIGMATECH CO., LTD. (1)
5,218,292 Apparatus for inspecting internal circuit of semiconductor device 19 1991
 
SILICON GRAPHICS INTERNATIONAL, CORP. (1)
5,127,570 Flexible automated bonding method and apparatus 45 1990
 
SLOAN TECHNOLOGY CORPORATION, A CORP. OF CA (1)
4,707,657 Connector assembly for a circuit board testing machine, a circuit board testing machine, and a method of testing a circuit board by means of a circuit board testing machine 147 1985
 
SPERRY CORPORATION (1)
4,647,126 Compliant lead clip 40 1985
 
STE. 230 CINCINNATI, OH 45242, A CORP. OF OH (1)
4,932,902 Ultra-high density electrical interconnect system 18 1989
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (1)
5,414,299 Semi-conductor device interconnect package assembly for improved package performance 143 1993
 
TEIJIN LIMITED (1)
5,355,283 Ball grid array with via interconnection 362 1993
 
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (1)
4,581,291 Microminiature coaxial cable and methods manufacture 20 1983
 
THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE (1)
4,640,499 Hermetic chip carrier compliant soldering pads 17 1985
 
TOKUSEN KOGYO KABUSHIKI KAISHA (1)
4,659,437 Method of thermal diffusion alloy plating for steel wire on continuous basis 16 1985
 
TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (1)
4,525,383 Method for manufacturing multilayer circuit substrate 21 1982
 
TOSHIBA CORPORATION (1)
4,542,438 Hybrid integrated circuit device 23 1982
 
U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE (1)
4,681,654 Flexible film semiconductor chip carrier 86 1986
 
U.S. PHILIPS CORPORATION (1)
4,442,967 Method of providing raised electrical contacts on electronic microcircuits 87 1982
 
UNISTRUCTURE, INC. (1)
4,922,376 Spring grid array interconnection for active microelectronic elements 65 1989
 
UTMC MICROELECTRONIC SYSTEMS INC. (1)
4,772,936 Pretestable double-sided tab design 76 1987
 
WHITAKER CORPORATION, THE (1)
5,313,368 Electrical connections between printed circuit boards and integrated circuits surface mounted thereon 18 1993
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (2)
4,746,300 Mounting panel for removable elements 13 1986
4,878,846 Electronic circuit chip connection assembly and method 35 1989

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
CASCADE MICROTECH, INC. (59)
7,233,160 Wafer probe 20 2001
7,355,420 Membrane probing system 3 2002
7,178,236 Method for constructing a membrane probe using a depression 5 2003
7,761,986 Membrane probing method using improved contact 1 2003
7,400,155 Membrane probing system 0 2004
7,161,363 Probe for testing a device under test 33 2004
7,042,241 Low-current pogo probe card 1 2004
7,427,868 Active wafer probe 10 2004
7,068,057 Low-current pogo probe card 6 2005
7,266,889 Membrane probing system 7 2005
7,148,714 POGO probe card for low current measurements 3 2005
7,075,320 Probe for combined signals 2 2005
7,148,711 Membrane probing system 12 2005
7,071,718 Low-current probe card 0 2005
7,109,731 Membrane probing system with local contact scrub 15 2005
7,368,927 Probe head having a membrane suspended probe 19 2005
7,420,381 Double sided probing structures 1 2005
7,656,172 System for testing semiconductors 3 2006
7,535,247 Interface for testing semiconductors 3 2006
7,271,603 Shielded probe for testing a device under test 32 2006
7,449,899 Probe for high frequency signals 0 2006
7,619,419 Wideband active-passive differential signal probe 0 2006
7,205,784 Probe for combined signals 2 2006
7,403,025 Membrane probing system 2 2006
7,533,462 Method of constructing a membrane probe 0 2006
7,304,488 Shielded probe for high-frequency testing of a device under test 4 2006
7,764,072 Differential signal probing system 1 2007
7,723,999 Calibration structures for differential signal probing 0 2007
7,403,028 Test structure and probe for differential signals 19 2007
7,285,969 Probe for combined signals 1 2007
7,443,186 On-wafer test structures for differential signals 2 2007
7,504,842 Probe holder for testing of a test device 0 2007
7,688,097 Wafer probe 1 2007
7,609,077 Differential signal probe with integral balun 0 2007
7,681,312 Membrane probing system 0 2007
7,541,821 Membrane probing system with local contact scrub 0 2007
7,453,276 Probe for combined signals 0 2007
7,518,387 Shielded probe for testing a device under test 1 2007
7,761,983 Method of assembling a wafer probe 1 2007
7,495,461 Wafer probe 0 2007
7,456,646 Wafer probe 1 2007
7,501,842 Shielded probe for testing a device under test 0 2007
7,498,829 Shielded probe for testing a device under test 1 2007
7,417,446 Probe for combined signals 1 2007
7,489,149 Shielded probe for testing a device under test 1 2007
7,482,823 Shielded probe for testing a device under test 1 2007
7,436,194 Shielded probe with low contact resistance for testing a device under test 0 2007
7,492,175 Membrane probing system 3 2008
7,514,944 Probe head having a membrane suspended probe 1 2008
7,750,652 Test structure and probe for differential signals 2 2008
8,013,623 Double sided probing structures 0 2008
7,876,114 Differential waveguide probe 0 2008
7,759,953 Active wafer probe 0 2008
7,888,957 Probing apparatus with impedance optimized interface 1 2008
7,898,281 Interface for testing semiconductors 0 2008
7,898,273 Probe for testing a device under test 0 2009
7,893,704 Membrane probing structure with laterally scrubbing contacts 0 2009
8,410,806 Replaceable coupon for a probing apparatus 0 2009
7,940,069 System for testing semiconductors 1 2009
 
ADVANTEST (SINGAPORE) PTE LTD (10)
6,815,961 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies 63 2002
7,349,223 Enhanced compliant probe card systems having improved planarity 16 2004
7,009,412 Massively parallel interface for electronic circuit 17 2004
7,247,035 Enhanced stress metal spring contactor 20 2004
7,382,142 High density interconnect system having rapid fabrication cycle 6 2005
7,952,373 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies 2 2006
7,621,761 Systems for testing and packaging integrated circuits 7 2007
7,872,482 High density interconnect system having rapid fabrication cycle 0 2007
7,772,860 Massively parallel interface for electronic circuit 0 2008
7,884,634 High density interconnect system having rapid fabrication cycle 0 2009
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (8)
6,539,625 Chromium adhesion layer for copper vias in low-k technology 5 2001
6,545,226 Printed wiring board interposer sub-assembly 7 2001
8,054,095 Metalized elastomeric probe structure 0 2005
7,491,067 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries 1 2007
7,491,068 Land grid array (LGA) interposer groups of different heights utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries 0 2007
7,488,182 Land grid array (LGA) interposer structure providing for electrical contacts on opposite sides of a carrier plane 1 2007
7,771,208 Metalized elastomeric electrical contacts 0 2008
7,658,616 Groups of land grid interposers of different heights having metal-on elastomer hemi-torus shapes providing for electrical contact with at least one component on an opposite side of an electrically insulating carrier plate mounting interposers 2 2008
 
FORMFACTOR, INC. (3)
7,082,682 Contact structures and methods for making same 0 2004
7,200,930 Probe for semiconductor devices 9 2005
7,990,164 Method of designing a probe card apparatus with desired compliance characteristics 0 2008
 
PWER BRIDGE, LLC (3)
6,750,396 I-channel surface-mount connector 2 2000
6,860,003 I-channel surface-mount connector 1 2002
6,722,930 I-channel surface-mount connector 0 2002
 
RENESAS ELECTRONICS CORPORATION (3)
7,791,204 Semiconductor device and method of manufacturing the same 2 2009
8,018,066 Semiconductor device and method of manufacturing the same 0 2010
8,314,495 Semiconductor device and method of manufacturing the same 0 2012
 
FCI AMERICAS TECHNOLOGY LLC (2)
7,476,110 High density connector and method of manufacture 6 2007
8,167,630 High density connector and method of manufacture 0 2010
 
INTEL CORPORATION (2)
7,183,493 Electronic assembly having multi-material interconnects 1 2004
7,421,778 Method of making an electronic assembly 0 2006
 
NANONEXUS CORPORATION (2)
7,579,848 High density interconnect system for IC packages and interconnect assemblies 10 2006
7,403,029 Massively parallel interface for electronic circuit 6 2006
 
RPX CORPORATION (2)
6,655,018 Technique for surface mounting electrical components to a circuit board 0 2001
6,897,378 Technique for surface mounting electrical components to a circuit board 0 2003
 
FREESCALE SEMICONDUCTOR, INC. (1)
7,723,224 Microelectronic assembly with back side metallization and method for forming the same 0 2006
 
KYOCERA CORPORATION (1)
6,417,461 Circuit substrate 4 2000
 
MAXIM INTEGRATED PRODUCTS, INC. (1)
7,982,305 Integrated circuit package including a three-dimensional fan-out / fan-in signal routing 0 2008
 
MICRON TECHNOLOGY, INC. (1)
8,101,459 Methods for assembling semiconductor devices in stacked arrangements by positioning spacers therebetween 0 2004
 
MURATA MANUFACTURING CO., LTD. (1)
7,820,916 Composite ceramic substrate 0 2005
 
NEC ELECTRONICS CORPORATION (1)
6,690,090 Semiconductor device having reliable coupling with mounting substrate 2 2002
 
SAMSUNG ELECTRONICS CO., LTD. (1)
7,714,421 Small structure and method for fabricating the same 0 2005
 
SHARP LABORATORIES OF AMERICA, INC. (1)
7,057,404 Shielded probe for testing a device under test 20 2003
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
8,152,535 Socket having two relay boards and a frame for holding a terminal to connect an electronic device to a mounting board 0 2011
 
ST-ERICSSON SA (1)
7,692,280 Portable object connectable package 0 2006
 
STMICROELECTRONICS, INC. (1)
7,456,050 System and method for controlling integrated circuit die height and planarity 0 2003
 
TESSERA, INC. (1)
6,885,106 Stacked microelectronic assemblies and methods of making same 28 2002
 
TYCO ELECTRONICS JAPAN G.K. (1)
6,830,461 Electrical contact and electrical connection device using same 6 2002
 
VALEO ETUDES ELECTRONIQUES (1)
8,039,973 Electronic module having a multi-layer conductor for reducing its resistivity and a method of assembling such a module 0 2007
 
WENTWORTH LABORATORIES, INC. (1)
7,282,934 Flexible microcircuit space transformer assembly 0 2005
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (1)
8,191,246 Method of manufacturing a plurality of miniaturized spring contacts 0 2010

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