THERMAL PASTE PREFORMS AS A HEAT TRANSFER MEDIA BETWEEN A CHIP AND A HEAT SINK AND METHOD THEREOF
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United States of America Patent
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Aug 14, 2001
Grant Date -
Sep 13, 2001
app pub date -
Dec 10, 1998
filing date -
Dec 10, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention relates generally to a new apparatus and method for introducing thermal paste into semiconductor packages. More particularly, the invention encompasses an apparatus and a method that uses at least one preform of thermal paste for the cooling of at least one chip in a sealed semiconductor package. The thermal paste preform is subcooled, and is transferred onto a module component from a separable transfer sheet, or is placed onto the module component using an attached and/or imbedded mesh. The preform of thermal paste may be of simple or complex shape, and enables cooling of one or more chips in a module.
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