Method and apparatus for forming plugs in vias of a circuit board layer
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United States of America Patent
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Aug 21, 2001
Grant Date -
N/A
app pub date -
Sep 24, 1998
filing date -
Sep 2, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
A method of forming one or more plugs in a circuit board layer is described which includes providing the circuit board layer, the circuit board layer having a first surface, a second surface, and defining a via containing a plug material in a volatile solvent, evaporating the volatile solvent, and curing the plug material. A product made according to the above method is also described.
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