Method and apparatus for forming solder bumps
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United States of America Patent
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-
Aug 21, 2001
Grant Date -
N/A
app pub date -
Apr 9, 1999
filing date -
Apr 10, 1998
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A method of forming solder bumps on pads formed on a surface of a base material includes the steps of supplying solder to a template having a number of through holes formed to correspond to the pads of the base material respectively so that the through holes are filled with the solder, the template having an upper side and an underside, scraping the sides of the template with doctors to remove an excessive amount of solder, and opposing the template to the base material so that the pads are aligned with the through holes respectively, covering the side of the template opposite to the base material with a pressure housing and increasing pressure in an interior of the pressure housing so that a difference in pressure between an exterior and the interior of the pressure housing extrudes the molten solder from the template to the pad side of the base material.
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