Corrosion sensitivity structures for vias and contact holes in integrated circuits
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United States of America Patent
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Aug 21, 2001
Issued Date -
N/A
app pub date -
Dec 15, 1999
filing date -
Mar 19, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
A die including a corrosion monitoring feature is described. The die includes: (i) a surface including an active die region and a scribeline region that is adjacent the active die region; (ii) an insulating layer disposed above the surface and includes a first corrosion sensitive metal plug and a second corrosion sensitive metal plug in the scribeline region; and (iii) a metallization layer positioned above the insulating layer, the first corrosion sensitive metal plug and the second corrosion sensitive metal plug in the scribeline region and the metallization layer disposed above second corrosion sensitive metal plug is patterned to provide the metallization layer with a first opening extending from a top surface of the metallization layer down to a top surface of the second corrosion sensitive metal plug such that a solvent introduced above the top surface of the metallization layer flows into the second corrosion sensitive metal plug disposed below through the first opening in the metallization layer.
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