Lead bonding machine for bonding leads of a chip disposed over a carrier tape to an electrode pad formed on the chip
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United States of America Patent
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Aug 28, 2001
Grant Date -
N/A
app pub date -
Jan 6, 1998
filing date -
Jan 7, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method and apparatus for stabilizing the form of a letter S of an inner lead after bonding in a method of manufacturing .mu.BGAoIC in which a chip is fixed via an insulating film on a tape carrier on one main surface of which plural inner leads are laid and each electrode pad of the chip is bonded to each inner lead is disclosed. The inner lead is bonded to the electrode pad when the chip is supplied in a fixed position for a bonding tool using a sprocket hole of the tape carrier. Next, the respective positions of the inner lead and the electrode pad are recognized using a feature lead and an electrode pad. Afterward, the center line of the inner lead is recognized, the inner lead is touched to the chip by the bonding tool and after the inner lead is pushed in the direction of the base and bent in the form of a letter S, the end of the inner lead is bonded to the electrode pad by thermocompression by the bonding tool.
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