Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
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United States of America Patent
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Aug 28, 2001
Grant Date -
N/A
app pub date -
Nov 2, 1998
filing date -
Nov 2, 1998
priority date (Note) -
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Abstract
An apparatus, as well as a method, determines an endpoint of chemical mechanical polishing a metal layer on a substrate. The method of the apparatus includes bringing a surface of a substrate into contact with a polishing pad that has a window; causing relative motion between the substrate and the polishing pad; directing a light beam through the window, the motion of the polishing pad relative to the substrate causing the light beam to move in a path across the substrate; detecting light beam reflections from the substrate and a retaining ring; generating reflection data associated with the light beam reflections; dividing the reflection data into a plurality of radial ranges; and identifying the predetermined pattern from the reflection data in the plurality of radial ranges to establish the endpoint.
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