Edge polishing composition

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United States of America Patent

PATENT NO 6280652
SERIAL NO

09323827

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Abstract

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An edge polishing composition for wafers, comprising water and silicon dioxide having an average particle size of from 70 to 2,500 nm.

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Patent Owner(s)

Patent OwnerAddress
FUJIMI INCORPORATED1-1 CHIRYO 2-CHOME NISHIBIWAJIMA-CHO KIYOSU-SHI AICHI 452-8502

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inoue, Yutaka Aichi, JP 78 820
Kawase, Akihiro Aichi, JP 4 73

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