Dielectric cure for reducing oxygen vacancies
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United States of America Patent
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Aug 28, 2001
Grant Date -
N/A
app pub date -
Jun 4, 1999
filing date -
Jun 4, 1999
priority date (Note) -
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Abstract
A unique electrochemical process fills oxygen vacancies in dielectrics while reducing oxidation of nearby electrodes and conductors. Preferably, an electromagnetic field or bias is applied to a dielectric. The bias causes oxygen vacancies in the dielectric to migrate to the surface of the dielectric. As the oxygen vacancies migrate toward the surface, oxygen ions fill the oxygen vacancies. In one embodiment, a unique plasma treatment provides the oxygen ions that react with the oxygen vacancies. In another embodiment, a unique electrolysis treatment provides the oxygen ions that react with the oxygen vacancies.
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