Apparatus and method for applying process solution
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United States of America Patent
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Aug 28, 2001
Grant Date -
N/A
app pub date -
May 14, 1999
filing date -
Jun 5, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
A process solution applying apparatus comprising a substrate holding mechanism for holding a substrate, a process solution supplying system for applying process solution in a prescribed amount to the substrate held by the substrate holding mechanism, the process solution supplying system having a supplying mechanism for changing a rate at which the process solution is supplied, and a substrate rotating mechanism for rotating the substrate holding mechanism, thus rotating the substrate at a predetermined speed to spread the process solution by virtue of centrifugal force and to coat the substrate with the process solution.
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