High-performance interconnect
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United States of America Patent
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Aug 28, 2001
Grant Date -
Aug 2, 2001
app pub date -
Mar 15, 2001
filing date -
Jan 21, 1998
priority date (Note) -
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Abstract
Techniques for providing high-performance interconnect for integrated circuits will improve overall integrated circuit performance. These techniques include arranging, laying out, and fabricating the signal conductors (e.g., 405, 720) so the parasitic coupling capacitances (e.g., 425) are minimized and parasitic resistance is reduced. The techniques will minimize effects of crosstalk noise between the conductors, and thus improve overall integrated circuit performance.
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