Conductive circuit device and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 28, 2001
Grant Date -
N/A
app pub date -
Feb 16, 1999
filing date -
Feb 10, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention facilitates the manufacturing of devices comprising printed circuits on flexible substrates. The objects of the invention are obtained by a device for feeding items to a manufacturing machine, where the device comprises a long flexible film arranged in a roll, and the film comprising a first protective layer for carrying each of the items. An adhesive agent, applied between the item and the protective layer, attaching the item to the protective layer. The first protective layer and the agent cooperating so that when the item is detached from the first protective layer substantially all of the adhesive agent is disposed on the item and where the item comprises a printed circuit.
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