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Abstract

A BGA (Ball-Grid Array) IC package with an unembedded type of heat-dissipation structure is proposed. The unembedded type of heat-dissipation structure is characterized in that a plurality of thermally-conductive vias are formed in the substrate and extending from the die-attachment area to the back side of the substrate; and further, a plurality of thermally-conductive balls are bonded to the thermally-conductive vias on the back side of the substrate. Moreover, a thermally-conductive layer is formed over a thermally-conductive area on the back side of the substrate on which the thermally-conductive balls are mounted for the purpose of increasing the exposed area of the overall heat-dissipation structure to the atmosphere. This allows the IC-produced heat during operation to be conducted through the thermally-conductive vias, the thermally-conductive balls, and the thermally-conductive layer to be dissipated the atmosphere. The unembedded manner of integration requires no openings to be formed in the substrate that would otherwise allow ambient moisture to enter into the inside of the package body as in the case of the prior art, and also allows the heat-dissipation structure to be more easily integrated to the package configuration. Due to these benefits, the BGA IC package can be manufactured through a more simplified and cost-effective process, while nevertheless providing a high heat-dissipation efficiency.

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