Thermoelectric cooling apparatus and method for maximizing energy transport
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United States of America Patent
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Sep 4, 2001
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N/A
app pub date -
Dec 9, 1999
filing date -
Dec 9, 1999
priority date (Note) -
Expired
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Abstract
Apparatus and method for sub-ambient cooling using thermoelectric dynamics in conjunction with novel configuration schemes to maximize energy transport to thereby increase the efficiency of thermoelectric cooling. In one form, a junction maximizes energy transport being positioned between and coupled to thermoelectric elements having minimal spacing to provide efficient thermoelectric cooling. Preferable implementations provide thermoelectric elements configured such that thermal energy is transferred away from the junction and dissipated by thermal sinks coupled to thermoelectric elements
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