Method and apparatus for semiconductor chip handling

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6283693
SERIAL NO

09440012

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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For stripping selected chips from a wafer of diced chips adhered, bottom surface down, to a flexible, elastic membrane, the bottom surface of the membrane is disposed against an apertured plate of a vacuum chuck for firmly holding the membrane in place with a group of the chips directly overlying push-up pins vertically movable through slots through the apertured plate. Selected pins are fired upwardly with sufficient speed to dislodge struck chips, but not non-selected adjacent chips, off the membrane and to hurl them, in free flight, upwardly against an overlying chip catching member. The stripped and caught chips are then transferred for storage or use.

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Patent Owner(s)

  • GENERAL SEMICONDUCTOR, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Acello, Salvatore St. James, NY 1 51
Ansinn, Detlev Warrington, PA 2 53

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