In situ friction detector method for finishing semiconductor wafers
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United States of America Patent
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Sep 4, 2001
Grant Date -
N/A
app pub date -
Nov 5, 1999
filing date -
Nov 6, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of using of using a friction detector for finishing semiconductor wafers. The method uses secondary friction sensors which can interpolate and add improved control to finishing. The method aids control of finishing while using lubricating boundary layers in the operative finishing interface. The method aids control of differential lubricating boundary layers and improved differential finishing of semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing. Defects can be reduced using the in situ friction detector method.
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