Non-abrasive conditioning for polishing pads
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United States of America Patent
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-
Sep 4, 2001
Grant Date -
N/A
app pub date -
Mar 8, 1999
filing date -
Mar 8, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and apparatus for resurfacing a polishing pad using non-abrasive techniques. These techniques include shaving, milling, or planing the upper working surface of the polishing pad using an edged cutting tool to alter the microtexture and micro-topology of the surface to produce a desired surface contour or planarity. This precise conditioning of the microscopic features of the polishing pad surface controls dishing in workpieces during polishing.
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