Film forming method and film forming apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 4, 2001
Issued Date -
N/A
app pub date -
Mar 7, 2000
filing date -
Mar 8, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A polyimide solution is supplied to a wafer and the wafer is rotated by means of a spin chuck, thereby forming a polyimide film on the wafer. An irradiator for irradiating a laser beam to a peripheral portion of the wafer W is provided. After the polyimide film is formed and side rinse is performed, a laser beam is irradiated to the peripheral portion to solidify the film at the peripheral portion. The solidified polyimide film forms a weir, thus preventing the polyimide solution which has not dried yet from flowing out toward a peripheral edge portion.
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