Thermal transfer donor element having a heat management underlayer
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United States of America Patent
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Sep 4, 2001
Grant Date -
N/A
app pub date -
Dec 28, 1999
filing date -
Dec 28, 1999
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Abstract
A thermal transfer donor element is disclosed that includes a substrate, a transfer layer, a light-to-heat conversion layer disposed between the substrate and the transfer layer, and an underlayer disposed between the substrate and the light-to-heat conversion layer. The underlayer manages heat flow between layers of the donor element during imaging. For example, the underlayer can increase heat transport from the light-to-heat conversion layer to the substrate to prevent overheating. The underlayer can also be used to insulate the substrate from heat generated in the light-to-heat conversion layer or to increase heat flow to the transfer layer during imaging. Managing heat flow using an underlayer can improve transfer properties and/or reduce defect formation during imaging.
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