Method for producing co-planar surface structures
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United States of America Patent
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Sep 4, 2001
Grant Date -
N/A
app pub date -
Dec 18, 1998
filing date -
Dec 18, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for producing co-planar surface areas is disclosed. At first a first layer with at least one recess is provided. Onto the first layer a second layer is deposited over the entire area of the first layer wherein the second layer has a thickness greater than the depth of the recess. The second layer is composed of material different to the material of the first layer. The next step removes the second layer completely beyond the area of at least one recess. The remaining portion of the second layer is removed until the second layer is coplanar with the first layer.
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