Three dimensional micro machining with a modulated ultra-short laser pulse
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United States of America Patent
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Sep 4, 2001
Grant Date -
N/A
app pub date -
May 10, 1999
filing date -
May 10, 1999
priority date (Note) -
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Abstract
A technique and apparatus is disclosed for micro machining using an ultra short laser pulse in the range of femto second pulsing. The system is also applicable for smaller or higher pulse rates depending upon the application. The system includes methods for improving the beam quality of the laser beam by filtering. Moreover, it includes the concept of scanning the laser beam using acousto optic deflectors in the X-Y direction rather than conventional mechanical movement of the work piece or deflecting the beam using a mirror. The technique also incorporates means for modulating the ultra short laser pulse in order to control the number of pulses of the ultra short laser pulse which will strike the target surface at each of the target points by a combination of acousto optic modulators. The concept of applying elliptical or circular laser beam spots for machining rather than a circular one is also disclosed.
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