Microprocessor subsystem module for PCB bottom-side BGA installation
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United States of America Patent
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-
Sep 4, 2001
Grant Date -
N/A
app pub date -
Sep 25, 1998
filing date -
Sep 25, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The inventive embedded processing subsystem module is adapted for backside circuit board assembly directly opposite of a specific microprocessor or Digital Signal Processor so that circuit groups such as memory banks and communications peripherals may utilize otherwise unused backside printed circuit board space underneath the processor device, and further so that high-speed signals interconnecting the processor and subsystem circuit devices traverse a minimized printed circuit track length.
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