Method for applying a resin to a substrate for use in papermaking
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United States of America Patent
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Sep 11, 2001
Grant Date -
N/A
app pub date -
Aug 22, 1996
filing date -
Aug 22, 1996
priority date (Note) -
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Abstract
The invention comprises a method for applying a curable resin such as a photosensitive resin, to a substrate such as a papermaker's dewatering felt. The method comprises the steps of providing a curable liquid resin, providing a substrate having a first surface and a second surface, the substrate comprising fibers defining voids intermediate the first and second surfaces, and the substrate comprising a second material different from the curable liquid resin, the second material coating at least some of the fibers, wherein the voids adjacent the coated fibers provide fluid communication from the first surface of the substrate to the second surface of the substrate; removing at least some of the second material coating at least some of the fibers; applying the curable liquid resin to the substrate; and curing at least some of the resin to provide a resin layer on the substrate.
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