Low cost decal material used for packaging
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United States of America Patent
Stats
-
Sep 11, 2001
Grant Date -
N/A
app pub date -
Oct 18, 1999
filing date -
Oct 18, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A new method is provided for mounting high-density IC semiconductor devices. A layer of epoxy is deposited over the first surface of a metal panel. One or more thin film interconnect layers are then created on top of the epoxy layer. The BUM technology allows for the creation of a succession of layers over the thin film layers. The combined layers of thin film and BUM form the interconnect substrate. One or more cavities are created in the second surface of the metal panel; openings through the layer of epoxy are created where the layer of epoxy is exposed. One or more IC semiconductor die are inserted into the cavities, are electrically connected to the openings that have been created in the layer of epoxy. Openings are created in the bottom BUM layer; solder balls are inserted and attached to this BUM layer for the completion of the Ball Grid Array (BGA) package.
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