US Patent No: 6,288,900

Number of patents in Portfolio can not be more than 2000

Warpage compensating heat spreader

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Importance

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Abstract

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A heat spreading cap is placed over a chip or integrated circuit. The cap is shaped or sized to provide a distinct heat spreading and/or stiffness characteristic that differs as it extends into different regions of the module. The areas of differing stiffness or CTE reduce the warpage (or bending) of the module, thereby reducing the overall stress in the BGA.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY76427

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Johnson, Eric A Greene, NY 113 1431
Park, Seungbae Fishkill, NY 8 75

Cited Art Landscape

Patent Info (Count) # Cites Year
 
ACER INCORPORATED (1)
5,736,785 Semiconductor package for improving the capability of spreading heat 89 1996
 
E-SYSTEMS, INC. (1)
5,287,248 Metal matrix composite heat transfer device and method 21 1992
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
5,247,426 Semiconductor heat removal apparatus with non-uniform conductance 22 1992
 
LSI LOGIC CORPORATION (1)
5,537,342 Encapsulation of electronic components 6 1994
 
MITSUBISHI MATERIALS CORPORATION (1)
5,675,474 Highly heat-radiating ceramic package 33 1995
 
MOTOROLA, INC. (1)
5,831,826 Heat transfer apparatus suitable for use in a circuit board assembly 7 1996
 
NEC CORPORATION (1)
5,777,847 Multichip module having a cover wtih support pillar 36 1997
 
RENESAS ELECTRONICS CORPORATION (1)
5,726,494 Semiconductor device having a plated heat sink 1 1997

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
LG ELECTRONICS INC. (6)
7,769,277 Recording medium having a data structure for managing reproduction of text subtitle data recorded thereon and recording and reproducing methods and apparatuses 2 2004
8,041,193 Recording medium having data structure for managing reproduction of auxiliary presentation data and recording and reproducing methods and apparatuses 0 2004
8,032,013 Recording medium having data structure for managing reproduction of text subtitle and recording and reproducing methods and apparatuses 0 2004
7,729,594 Recording medium and method and apparatus for reproducing text subtitle stream including presentation segments encapsulated into PES packet 3 2005
8,538,240 Recording medium and method and apparatus for reproducing text subtitle stream recorded on the recording medium 0 2009
8,447,172 Recording medium having a data structure for managing reproduction of text subtitle data recorded thereon and recording and reproducing methods and apparatuses 0 2010
 
INTEL CORPORATION (4)
6,667,548 Diamond heat spreading and cooling technique for integrated circuits 36 2001
6,748,350 Method to compensate for stress between heat spreader and thermal interface material 21 2001
7,132,313 Diamond heat spreading and cooling technique for integrated circuits 16 2003
7,358,606 Apparatus to compensate for stress between heat spreader and thermal interface material 2 2004
 
SILICONWARE PRECISION INDUSTRIES CO., LTD. (4)
6,469,897 Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same 18 2001
6,433,420 Semiconductor package with heat sink having air vent 42 2001
6,844,622 Semiconductor package with heat sink 9 2001
7,074,645 Fabrication method of semiconductor package with heat sink 3 2004
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (3)
6,713,863 Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion 11 2001
6,864,120 Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion 1 2004
8,674,499 Heat radiation component and semiconductor package including same 0 2011
 
XILINX, INC. (3)
7,906,857 Molded integrated circuit package and method of forming a molded integrated circuit package 2 2008
8,362,609 Integrated circuit package and method of forming an integrated circuit package 0 2009
8,810,028 Integrated circuit packaging devices and methods 0 2010
 
ALTERA CORPORATION (2)
6,784,536 Symmetric stack up structure for organic BGA chip carriers 4 2001
6,882,041 Thermally enhanced metal capped BGA package 17 2002
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
6,486,554 Molded body for PBGA and chip-scale packages 17 2001
6,713,858 Flip-chip package with optimized encapsulant adhesion and method 0 2003
 
MARVELL INTERNATIONAL LTD. (2)
8,581,374 Placing heat sink into packaging by strip formation assembly 0 2011
8,741,694 Placing heat sink into packaging by strip formation assembly 0 2013
 
SUN MICROSYSTEMS, INC. (2)
6,727,193 Apparatus and methods for enhancing thermal performance of integrated circuit packages 1 2002
6,637,506 Multi-material heat spreader 4 2002
 
Endicott International Technologies, Inc. (1)
6,958,106 Material separation to form segmented product 1 2003
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
7,228,894 Heat spreader with controlled Z-axis conductivity 9 2004
 
HONEYWELL INTERNATIONAL INC. (1)
6,906,413 Integrated heat spreader lid 6 2003
 
INTEL MOBILE COMMUNICATIONS GMBH (1)
7,906,860 Semiconductor device 10 2007
 
LOCKHEED MARTIN CORPORATION (1)
7,804,179 Plastic ball grid array ruggedization 0 2008
 
PANASONIC ELECTRIC WORKS CO., LTD. (1)
7,057,277 Chip package structure 21 2004
 
RENESAS EASTERN JAPAN SEMICONDUCTOR, INC. (1)
6,975,026 Package for mounting semiconductor device 0 2003
 
SAMSUNG ELECTRONICS CO., LTD. (1)
8,648,478 Flexible heat sink having ventilation ports and semiconductor package including the same 0 2011
 
ST ASSEMBLY TEST SERVICES LTD. (1)
6,750,534 Heat spreader hole pin 1 identifier 2 2002
 
UNITED TEST AND ASSEMBLY CENTER LTD. (1)
8,039,951 Thermally enhanced semiconductor package and method of producing the same 0 2006
 
VIA TECHNOLOGIES, INC. (1)
6,639,324 Flip chip package module and method of forming the same 22 2002