US Patent No: 6,288,900

Number of patents in Portfolio can not be more than 2000

Warpage compensating heat spreader

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Importance

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Abstract

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A heat spreading cap is placed over a chip or integrated circuit. The cap is shaped or sized to provide a distinct heat spreading and/or stiffness characteristic that differs as it extends into different regions of the module. The areas of differing stiffness or CTE reduce the warpage (or bending) of the module, thereby reducing the overall stress in the BGA.

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First Claim

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Johnson, Eric A Greene, NY 97 1788
Park, Seungbae Fishkill, NY 9 78

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (8)
5,287,248 Metal matrix composite heat transfer device and method 22 1992
5,247,426 Semiconductor heat removal apparatus with non-uniform conductance 25 1992
5,537,342 Encapsulation of electronic components 6 1994
* 5,675,474 Highly heat-radiating ceramic package 34 1995
5,831,826 Heat transfer apparatus suitable for use in a circuit board assembly 12 1996
5,736,785 Semiconductor package for improving the capability of spreading heat 92 1996
* 5,726,494 Semiconductor device having a plated heat sink 1 1997
5,777,847 Multichip module having a cover wtih support pillar 39 1997
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (66)
* 6,713,863 Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion 12 2001
* 6,469,897 Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same 19 2001
* 6,486,554 Molded body for PBGA and chip-scale packages 21 2001
* 6,667,548 Diamond heat spreading and cooling technique for integrated circuits 50 2001
* 6,433,420 Semiconductor package with heat sink having air vent 46 2001
* 6,844,622 Semiconductor package with heat sink 10 2001
* 6,784,536 Symmetric stack up structure for organic BGA chip carriers 4 2001
* 6,748,350 Method to compensate for stress between heat spreader and thermal interface material 27 2001
6,882,041 Thermally enhanced metal capped BGA package 25 2002
6,727,193 Apparatus and methods for enhancing thermal performance of integrated circuit packages 1 2002
* 6,637,506 Multi-material heat spreader 6 2002
* 2003/0171,006 Apparatus and methods for enhancing thermal performance of integrated circuit packages 0 2002
* 6,750,534 Heat spreader hole pin 1 identifier 2 2002
* 6,639,324 Flip chip package module and method of forming the same 36 2002
* 6,713,858 Flip-chip package with optimized encapsulant adhesion and method 0 2003
* 2003/0203,535 Flip-chip package with optimized encapsulant adhesion and method 1 2003
* 2004/0195,362 Rotating stream sprinkler with torque balanced reaction drive 2 2003
6,958,106 Material separation to form segmented product 1 2003
* 6,975,026 Package for mounting semiconductor device 0 2003
* 2004/0007,383 Package for mounting semiconductor device 0 2003
* 6,906,413 Integrated heat spreader lid 12 2003
* 2004/0238,944 Integrated heat spreader lid 1 2003
* 2005/0068,751 Floating trace on signal layer 2 2003
7,132,313 Diamond heat spreading and cooling technique for integrated circuits 31 2003
* 2004/0104,014 Diamond heat spreading and cooling technique for integrated circuits 1 2003
* 2005/0127,484 Die extender for protecting an integrated circuit die on a flip chip package 1 2003
* 7,057,277 Chip package structure 23 2004
* 2004/0212,056 [CHIP PACKAGE STRUCTURE] 0 2004
* 6,864,120 Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion 3 2004
* 7,228,894 Heat spreader with controlled Z-axis conductivity 13 2004
7,358,606 Apparatus to compensate for stress between heat spreader and thermal interface material 2 2004
* 2004/0217,467 Apparatus to compensate for stress between heat spreader and thermal interface material 0 2004
7,769,277 Recording medium having a data structure for managing reproduction of text subtitle data recorded thereon and recording and reproducing methods and apparatuses 3 2004
8,041,193 Recording medium having data structure for managing reproduction of auxiliary presentation data and recording and reproducing methods and apparatuses 0 2004
8,032,013 Recording medium having data structure for managing reproduction of text subtitle and recording and reproducing methods and apparatuses 0 2004
* 2005/0084,247 Recording medium having data structure for managing reproduction of auxiliary presentation data and recording and reproducing methods and apparatuses 3 2004
* 2005/0084,248 Recording medium having data structure for managing reproduction of text subtitle data and recording and reproducing methods and apparatuses 12 2004
* 2005/0078,948 Recording medium having data structure for managing reproduction of text subtitle and recording and reproducing methods and apparatuses 6 2004
* 2005/0062,149 Integral heatsink ball grid array 6 2004
7,074,645 Fabrication method of semiconductor package with heat sink 5 2004
7,729,594 Recording medium and method and apparatus for reproducing text subtitle stream including presentation segments encapsulated into PES packet 3 2005
* 2005/0207,738 Recording medium and method and apparatus for reproducing text subtitle stream recorded on the recording medium 0 2005
* 2006/0273,450 Solid-diffusion, die-to-heat spreader bonding methods, articles achieved thereby, and apparatus used therefor 6 2005
* 2005/0224,167 Material separation to form segmented product 1 2005
* 2006/0231,944 Thermally enhanced semiconductor package and fabrication method thereof 30 2006
* 2007/0114,677 Semiconductor package with heat sink, stack package using the same and manufacturing method thereof 9 2006
* 8,039,951 Thermally enhanced semiconductor package and method of producing the same 1 2006
* 2007/0164,425 Thermally enhanced semiconductor package and method of producing the same 3 2006
* 7,906,860 Semiconductor device 14 2007
* 2009/0108,440 SEMICONDUCTOR DEVICE 28 2007
* 7,906,857 Molded integrated circuit package and method of forming a molded integrated circuit package 7 2008
7,804,179 Plastic ball grid array ruggedization 0 2008
* 2009/0267,227 PLASTIC BALL GRID ARRAY RUGGEDIZATION 0 2008
* 2009/0317,947 Semiconductor package with heat sink, stack package using the same and manufacturing method thereof 2 2009
8,362,609 Integrated circuit package and method of forming an integrated circuit package 2 2009
8,538,240 Recording medium and method and apparatus for reproducing text subtitle stream recorded on the recording medium 0 2009
8,447,172 Recording medium having a data structure for managing reproduction of text subtitle data recorded thereon and recording and reproducing methods and apparatuses 0 2010
8,810,028 Integrated circuit packaging devices and methods 0 2010
* 2011/0049,702 SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME 0 2010
* 2011/0039,014 COMPOSITE PROSTHETIC BEARING HAVING A CROSSLINKED ARTICULATING SURFACE AND METHOD FOR MAKING THE SAME 2 2010
* 8,674,499 Heat radiation component and semiconductor package including same 0 2011
* 2011/0291,258 HEAT RADIATION COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING SAME 3 2011
* 8,648,478 Flexible heat sink having ventilation ports and semiconductor package including the same 0 2011
* 2011/0316,144 FLEXIBLE HEAT SINK HAVING VENTILATION PORTS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME 1 2011
* 8,581,374 Placing heat sink into packaging by strip formation assembly 2 2011
8,741,694 Placing heat sink into packaging by strip formation assembly 0 2013
* Cited By Examiner