US Patent No: 6,288,900

Number of patents in Portfolio can not be more than 2000

Warpage compensating heat spreader

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Importance

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Abstract

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A heat spreading cap is placed over a chip or integrated circuit. The cap is shaped or sized to provide a distinct heat spreading and/or stiffness characteristic that differs as it extends into different regions of the module. The areas of differing stiffness or CTE reduce the warpage (or bending) of the module, thereby reducing the overall stress in the BGA.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
GLOBALFOUNDRIES INC.SUNNYVALE, CA16025

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Johnson, Eric A Greene, NY 95 1749
Park, Seungbae Fishkill, NY 9 76

Cited Art Landscape

Patent Info (Count) # Cites Year
 
NEC CORPORATION (1)
5,777,847 Multichip module having a cover wtih support pillar 39 1997
 
ACER INCORPORATED (1)
5,736,785 Semiconductor package for improving the capability of spreading heat 92 1996
 
E-SYSTEMS, INC. (1)
5,287,248 Metal matrix composite heat transfer device and method 22 1992
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
5,247,426 Semiconductor heat removal apparatus with non-uniform conductance 25 1992
 
LSI LOGIC CORPORATION (1)
5,537,342 Encapsulation of electronic components 6 1994
 
RENESAS ELECTRONICS CORPORATION (1)
* 5,726,494 Semiconductor device having a plated heat sink 1 1997
 
MITSUBISHI MATERIALS CORPORATION (1)
* 5,675,474 Highly heat-radiating ceramic package 34 1995
 
MOTOROLA, INC. (1)
5,831,826 Heat transfer apparatus suitable for use in a circuit board assembly 12 1996
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (1)
* 2009/0317,947 Semiconductor package with heat sink, stack package using the same and manufacturing method thereof 2 2009
 
VIA TECHNOLOGIES, INC. (1)
* 6,639,324 Flip chip package module and method of forming the same 36 2002
 
SAMSUNG ELECTRONICS CO., LTD. (3)
* 2007/0114,677 Semiconductor package with heat sink, stack package using the same and manufacturing method thereof 8 2006
* 8,648,478 Flexible heat sink having ventilation ports and semiconductor package including the same 0 2011
* 2011/0316,144 FLEXIBLE HEAT SINK HAVING VENTILATION PORTS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME 1 2011
 
Altera Corporation (2)
* 6,784,536 Symmetric stack up structure for organic BGA chip carriers 4 2001
6,882,041 Thermally enhanced metal capped BGA package 25 2002
 
XILINX, INC. (3)
* 7,906,857 Molded integrated circuit package and method of forming a molded integrated circuit package 6 2008
8,362,609 Integrated circuit package and method of forming an integrated circuit package 2 2009
8,810,028 Integrated circuit packaging devices and methods 0 2010
 
ORACLE AMERICA, INC. (3)
6,727,193 Apparatus and methods for enhancing thermal performance of integrated circuit packages 1 2002
* 6,637,506 Multi-material heat spreader 6 2002
* 2003/0171,006 Apparatus and methods for enhancing thermal performance of integrated circuit packages 0 2002
 
STATS CHIPPAC PTE. LTE. (1)
* 6,750,534 Heat spreader hole pin 1 identifier 2 2002
 
MARVELL INTERNATIONAL LTD. (2)
* 8,581,374 Placing heat sink into packaging by strip formation assembly 2 2011
8,741,694 Placing heat sink into packaging by strip formation assembly 0 2013
 
Endicott International Technologies, Inc. (1)
6,958,106 Material separation to form segmented product 1 2003
 
LOCKHEED MARTIN CORPORATION (1)
7,804,179 Plastic ball grid array ruggedization 0 2008
 
INTEL DEUTSCHLAND GMBH (2)
* 7,906,860 Semiconductor device 14 2007
* 2009/0108,440 SEMICONDUCTOR DEVICE 25 2007
 
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. (1)
* 2005/0224,167 Material separation to form segmented product 1 2005
 
LG ELECTRONICS INC. (10)
7,769,277 Recording medium having a data structure for managing reproduction of text subtitle data recorded thereon and recording and reproducing methods and apparatuses 3 2004
8,041,193 Recording medium having data structure for managing reproduction of auxiliary presentation data and recording and reproducing methods and apparatuses 0 2004
8,032,013 Recording medium having data structure for managing reproduction of text subtitle and recording and reproducing methods and apparatuses 0 2004
* 2005/0084,247 Recording medium having data structure for managing reproduction of auxiliary presentation data and recording and reproducing methods and apparatuses 3 2004
* 2005/0084,248 Recording medium having data structure for managing reproduction of text subtitle data and recording and reproducing methods and apparatuses 12 2004
* 2005/0078,948 Recording medium having data structure for managing reproduction of text subtitle and recording and reproducing methods and apparatuses 6 2004
7,729,594 Recording medium and method and apparatus for reproducing text subtitle stream including presentation segments encapsulated into PES packet 3 2005
* 2005/0207,738 Recording medium and method and apparatus for reproducing text subtitle stream recorded on the recording medium 0 2005
8,538,240 Recording medium and method and apparatus for reproducing text subtitle stream recorded on the recording medium 0 2009
8,447,172 Recording medium having a data structure for managing reproduction of text subtitle data recorded thereon and recording and reproducing methods and apparatuses 0 2010
 
RENESAS EASTERN JAPAN SEMICONDUCTOR, INC. (2)
* 6,975,026 Package for mounting semiconductor device 0 2003
* 2004/0007,383 Package for mounting semiconductor device 0 2003
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
* 6,486,554 Molded body for PBGA and chip-scale packages 20 2001
* 6,713,858 Flip-chip package with optimized encapsulant adhesion and method 0 2003
* 2003/0203,535 Flip-chip package with optimized encapsulant adhesion and method 1 2003
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
* 7,228,894 Heat spreader with controlled Z-axis conductivity 12 2004
 
CHIPPAC, INC. (1)
* 2005/0062,149 Integral heatsink ball grid array 4 2004
 
RAIN BIRD CORPORATION (1)
* 2004/0195,362 Rotating stream sprinkler with torque balanced reaction drive 1 2003
 
DEPUY SYNTHES PRODUCTS, LLC (1)
* 2011/0039,014 COMPOSITE PROSTHETIC BEARING HAVING A CROSSLINKED ARTICULATING SURFACE AND METHOD FOR MAKING THE SAME 2 2010
 
BEIJING XIAOMI MOBILE SOFTWARE CO., LTD. (3)
* 6,748,350 Method to compensate for stress between heat spreader and thermal interface material 27 2001
7,358,606 Apparatus to compensate for stress between heat spreader and thermal interface material 2 2004
* 2004/0217,467 Apparatus to compensate for stress between heat spreader and thermal interface material 0 2004
 
Siliconware Precision Industries Co., Ltd. (5)
* 6,469,897 Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same 19 2001
* 6,433,420 Semiconductor package with heat sink having air vent 46 2001
* 6,844,622 Semiconductor package with heat sink 10 2001
7,074,645 Fabrication method of semiconductor package with heat sink 5 2004
* 2006/0231,944 Thermally enhanced semiconductor package and fabrication method thereof 30 2006
 
HONEYWELL INTERNATIONAL INC. (2)
* 6,906,413 Integrated heat spreader lid 12 2003
* 2004/0238,944 Integrated heat spreader lid 1 2003
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (5)
* 6,713,863 Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion 12 2001
* 6,864,120 Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion 3 2004
* 2011/0049,702 SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME 0 2010
* 8,674,499 Heat radiation component and semiconductor package including same 0 2011
* 2011/0291,258 HEAT RADIATION COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING SAME 1 2011
 
UTAC HEADQUARTERS PTE. LTD. (2)
* 8,039,951 Thermally enhanced semiconductor package and method of producing the same 1 2006
* 2007/0164,425 Thermally enhanced semiconductor package and method of producing the same 2 2006
 
INTEL CORPORATION (5)
* 6,667,548 Diamond heat spreading and cooling technique for integrated circuits 47 2001
* 2005/0068,751 Floating trace on signal layer 2 2003
7,132,313 Diamond heat spreading and cooling technique for integrated circuits 29 2003
* 2004/0104,014 Diamond heat spreading and cooling technique for integrated circuits 1 2003
* 2006/0273,450 Solid-diffusion, die-to-heat spreader bonding methods, articles achieved thereby, and apparatus used therefor 6 2005
 
Texas Instruments Incorporated (1)
* 2005/0127,484 Die extender for protecting an integrated circuit die on a flip chip package 1 2003
 
PANASONIC ELECTRIC WORKS CO., LTD. (2)
* 7,057,277 Chip package structure 23 2004
* 2004/0212,056 [CHIP PACKAGE STRUCTURE] 0 2004
* Cited By Examiner