Optimized emulation and prototyping architecture

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United States of America Patent

PATENT NO 6289494
SERIAL NO

08968401

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Abstract

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A logic chip useful for emulation and prototyping of integrated circuits. The logic chip comprises a plurality of logic elements, which is divided into a plurality of subsets of logic elements. The logic chip further comprises a plurality of first level interconnects. The plurality of first level interconnects interconnect one of the plurality of subsets of logic elements, thereby forming a plurality of first level logical units. The plurality of first level logical units is divided into a plurality of subsets of first level logical units. The logic chip also comprises a plurality of second level interconnects. The second level interconnects interconnect one of the plurality of subsets of first level logic units, thereby forming a plurality of second level logic units. The logic chip also comprises a third level interconnect. The third level interconnect interconnects the plurality of second level logic units, thereby forming a third level logic

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Patent Owner(s)

Patent OwnerAddress
CADENCE DESIGN SYSTEMS INC2655 SEELY AVENUE SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Butts, Michael R Portland, OR 40 2617
Sample, Stephen P Saratoga, CA 39 2816

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