Importance

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Abstract

A jet-cleaning device for a developing station is proposed, which jet-cleaning device is capable of removing chemical solution from the back surface of a silicon wafer without the need to perform time-consuming adjustment of knife ring position. The jet-cleaning device has a spin suction pad, a plurality of air nozzles and knife ring. The spin suction pad is used to support a silicon wafer. The spin suction pad has an external diameter smaller than the silicon wafer so that an peripheral portion of the wafer back surface is exposed. The plurality of air nozzles are positioned under the spin suction pad and mounted on a substrate plate. The air nozzles send out air jets directing at the exposed back surface of the wafer so that any dripping chemical solution can be blown away. The knife ring is installed under the wafer around the spin suction pad to prevent the sputtering of chemical solution back into the spin suction pad.

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First Claim