Sputtering method for forming dielectric films
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United States of America Patent
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Sep 18, 2001
Grant Date -
N/A
app pub date -
Dec 23, 1999
filing date -
Jan 26, 1999
priority date (Note) -
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Abstract
A method for forming a dielectric film having a desired composition comprising sputtering a dielectric material onto a substrate to produce an intermediary film, the intermediary film incorporating one or more elements in addition to those elements included in the desired composition of the dielectric film; and removing the one or more additional elements from the intermediary film to produce the dielectric film having the desired composition.
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