Package for multiple high power electrical components
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United States of America Patent
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-
Sep 18, 2001
Grant Date -
N/A
app pub date -
Apr 22, 1993
filing date -
Apr 22, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor package includes a plurality of semiconductor devices disposed in an array surrounding a central electrode structure carried by a package support member. The package is capable of withstanding high voltages and currents and includes a heat exchanger integral therewith.
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Cited Art Landscape
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