Fixed abrasive finishing method using lubricants
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United States of America Patent
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-
Sep 25, 2001
Grant Date -
N/A
app pub date -
Nov 5, 1999
filing date -
Nov 6, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Fixed abrasive finishing method using lubricants A method of using a fixed abrasive finishing element method using lubricants for finishing semiconductor wafers is described. During the lubricating boundary layer thickness is controlled to improve finishing and reduce unwanted surface defects. Differential lubricating boundary layer methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing. Boundary layer lubricants recommended.
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