Curable polymeric composition and use in protecting a substrate
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United States of America Patent
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Sep 25, 2001
Issued Date -
N/A
app pub date -
Aug 4, 1997
filing date -
Mar 11, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A curable polymeric composition which is a liquid at 20.degree. C. and which comprises 25 to 60% by weight of a resin component which comprises an epoxy, 5 to 25% by weight of a curing agent which comprises two components, a first component which is a cycloaliphatic amine or an aromatic amine, and a second component which is a polyamide amine, and 20 to 65% by weight of an inert inorganic filler. The curable composition can be used in a method of protecting a substrate such as a pipe or a pipe joint from corrosion or mechanical damage. In the method, the curable composition is first applied to the substrate, a polymeric covering layer is applied over the curable composition with an innermost layer of a heat-activatable sealant in intimate contact with the curable composition, and the curable composition is then cured. During the curing process, the heat-activatable sealant, e.g. a hot melt adhesive, remains in contact with the curable composition and interacts therewith.
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