Molded electronic component having pre-plated lead terminals and manufacturing process thereof
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United States of America Patent
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Sep 25, 2001
Issued Date -
N/A
app pub date -
Aug 17, 2000
filing date -
Jul 26, 1996
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A molded elecronic component such as a solid electrolyte capacitor comprising a capacitor element including a cathode layer, an anode lead, a pre-plated anode lead terminal connected to the anode lead, a pre-plated cathode lead terminal connected to the cathode layer, and an insulating member which encapsulates the capacitor element and leaves a portion of the anode and cathode lead terminals exposed. The encapsulated portions of the pre-plated anode and cathode lead terminals have a plating layer formed thereon containing organic substances in an amount of 0.03 wt. % or less. Also disclosed is a process for manufacturing the solid electrolyte capacitor.
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