Microelectronic assembly with conductive terminals having an exposed surface through a dielectric layer
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United States of America Patent
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Sep 25, 2001
Issued Date -
N/A
app pub date -
Sep 30, 1999
filing date -
Apr 18, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
A microelectronic assembly includes a microelectronic element having a front face including contacts and a back surface remote therefrom, and a mass of a dielectric material at least partially encapsulating the microelectronic element so that the encapsulated microelectronic element forms a body having exterior surfaces, whereby the back surface of the microelectronic element is exposed at an exterior surface of the body. The microelectronic assembly also includes conductive units secured to the mass of dielectric material, the units including bottom flange portions overlying a surface of the body, top flange portions remote from the bottom flange portions and posts extending from the flange portions into the body, the bottom and top flange portions having larger cross-sectional dimensions than the posts, and conductive elements extending through the mass of dielectric material, the conductive elements electrically interconnecting the contacts with the conductive units.
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