Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
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United States of America Patent
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-
Oct 2, 2001
Issued Date -
N/A
app pub date -
Oct 12, 1999
filing date -
Feb 23, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.
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