Method and apparatus for optical monitoring in chemical mechanical polishing
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United States of America Patent
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Oct 2, 2001
Issued Date -
N/A
app pub date -
Jun 8, 2000
filing date -
Nov 2, 1998
priority date (Note) -
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Abstract
An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. Light beam reflections from the substrate are detected, and used to determine polishing parameters, detect process repeatability, and qualify processes.
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