Copper coated polyimide with metallic protective layer
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United States of America Patent
Stats
-
Oct 2, 2001
Grant Date -
N/A
app pub date -
Sep 16, 1999
filing date -
Sep 16, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A component for use in manufacturing printed circuits, comprising: a laminate that in a finished printed circuit constitutes a functional element, the laminate comprised of: a film substrate formed of a first polymeric material; at least one layer of a flash metal applied to a first side of the film substrate, and at least one layer of copper on the at least one layer of a flash metal, the layer of copper having an essentially uncontaminated exposed surface facing away from the at least one layer of flash metal; and a planar layer of metal that constitutes a discardable element, the layer of metal having an essentially uncontaminated surface that is inert to copper, the laminate being attached to the layer of metal at its borders to define a substantially uncontaminated central zone inwardly of the edges of the sheet that is unjoined at the interfaces.
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