US Patent No: 6,297,548

Number of patents in Portfolio can not be more than 2000

Stackable ceramic FBGA for high thermal applications

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Importance

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Abstract

An apparatus package for high temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.

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First Claim

Related Publications

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID18599

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Corisis, David J Meridian, ID 341 4829
Kinsman, Larry D Kuna, ID 215 3692
Mess, Leonard E Boise, ID 50 844
Moden, Walter L Meridian, ID 195 3744

Cited Art

Patent Info (Count) # Cites Year
 
FREESCALE SEMICONDUCTOR, INC. (5)
5,218,759 Method of making a transfer molded semiconductor device 87 1991
5,173,764 Semiconductor device having a particular lid means and encapsulant to reduce die stress 56 1991
5,379,186 Encapsulated electronic component having a heat diffusing layer 66 1993
5,450,283 Thermally enhanced semiconductor device having exposed backside and method for making the same 206 1994
5,436,203 Shielded liquid encapsulated semiconductor device and method for making the same 204 1994
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (4)
4,323,914 Heat transfer structure for integrated circuit package 145 1979
4,862,245 Package semiconductor chip 512 1988
5,194,930 Dielectric composition and solder interconnection structure for its use 100 1991
5,280,192 Three-dimensional memory card structure with internal direct chip attachment 95 1992
 
KABUSHIKI KAISHA TOSHIBA (3)
5,394,303 Semiconductor device 225 1993
5,641,997 Plastic-encapsulated semiconductor device 261 1994
5,656,857 Semiconductor device with insulating resin layer and substrate having low sheet resistance 63 1995
 
LSI LOGIC CORPORATION (2)
5,311,060 Heat sink for semiconductor device assembly 122 1992
5,489,538 Method of die burn-in 80 1995
 
MICRON TECHNOLOGY, INC. (2)
5,304,842 Dissimilar adhesive die attach for semiconductor devices 203 1992
5,866,953 Packaged die on PCB with heat sink encapsulant 143 1996
 
MITSUBISHI DENKI KABUSHIKI KAISHA (2)
5,252,853 Packaged semiconductor device having tab tape and particular power distribution lead structure 268 1992
5,440,169 Resin-packaged semiconductor device with flow prevention dimples 62 1994
 
SAMSUNG ELECTRONICS CO., LTD. (2)
5,604,376 Paddleless molded plastic semiconductor chip package 229 1994
5,552,635 High thermal emissive semiconductor device package 150 1995
 
ADVANCED MICRO DEVICES, INC. (1)
4,931,852 High thermal conductivity/low alpha emission molding compound containing high purity semiconductor filler and integrated circuit package 42 1988
 
AMKOR TECHNOLOGY, INC. (1)
5,108,955 Method of making a resin encapsulated pin grid array with integral heatsink 63 1991
 
AT&T BELL LABORATORIES (1)
5,101,465 Leadframe-based optical assembly 51 1990
 
BELL TELEPHONE LABORATORIES, INCORPORATED (1)
5,051,275 Silicone resin electronic device encapsulant 56 1989
 
COMPAGNIE INTERNATIONALE POUR L'INFORMATIQUE CII-HONEYWELL BULL (SOCIETE ANONYME) (1)
4,264,917 Flat package for integrated circuit devices 129 1979
 
FUJITSU LIMITED (1)
4,984,059 Semiconductor device and a method for fabricating the same 149 1983
 
HITACHI, LTD. (1)
5,184,208 Semiconductor device 81 1991
 
INTEGRATED SYSTEM ASSEMBLIES CORPORATION, A CORP. OF DE (1)
5,144,747 Apparatus and method for positioning an integrated circuit chip within a multichip module 101 1991
 
INTEL CORPORATION (1)
5,489,801 Quad flat package heat slug composition 55 1995
 
LOCKHEED MARTIN CORPORATION (1)
5,241,456 Compact high density interconnect structure 211 1990
 
LUCAS INDUSTRIES, A LIMITED COMPANY OF BRITISH (1)
4,642,671 Semi-conductor assembly 37 1983
 
MATSUSHITA ELECTRONICS CORPORATION (1)
4,507,675 Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor 51 1982
 
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION (1)
5,344,795 Method for encapsulating an integrated circuit using a removable heatsink support block 60 1992
 
MITSUBISHI ELECTRIC CORPORATION (1)
5,754,408 Stackable double-density integrated circuit assemblies 53 1995
 
MOTOROLA, INC. (1)
4,961,107 Electrically isolated heatsink for single-in-line package 48 1989
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
5,434,105 Process for attaching a lead frame to a heat sink using a glob-top encapsulation 51 1994
 
OKI ELECTRIC INDUSTRY CO., LTD. (1)
4,801,998 EPROM device 74 1987
 
PLASKON ELECTRONIC MATERIALS, LTD., A CORP. OF BERMUDA (1)
4,358,552 Epoxy resinous molding compositions having low coefficient of thermal expansion and high thermal conductivity 74 1981
 
RENESAS ELECTRONICS CORPORATION (1)
5,488,254 Plastic-molded-type semiconductor device 47 1994
 
ROUND ROCK RESEARCH, LLC (1)
5,286,679 Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer 238 1993
 
SEIKO EPSON CORPORATION (1)
5,652,461 Semiconductor device with a convex heat sink 45 1994
 
SHARP KABUSHIKI KAISHA (1)
4,300,153 Flat shaped semiconductor encapsulation 118 1980
 
TESSERA, INC. (1)
5,659,952 Method of fabricating compliant interface for semiconductor chip 222 1994
 
TEXAS INSTRUMENTS INCORPORATED (1)
5,461,255 Multi-layered lead frame assembly for integrated circuits 107 1994
 
VLSI PACKAGING CORPORATION (1)
5,598,034 Plastic packaging of microelectronic circuit devices 83 1992
 
VLSI TECHNOLOGY, INC. (1)
5,441,684 Method of forming molded plastic packages with integrated heat sinks 42 1993

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
AMKOR TECHNOLOGY, INC. (117)
7,102,208 Leadframe and semiconductor package with improved solder joint strength 2 2000
6,730,544 Stackable semiconductor package and method for manufacturing same 34 2000
6,586,826 Integrated circuit package having posts for connection to other packages and substrates 13 2001
6,919,620 Compact flash memory card with clamshell leadframe 1 2002
6,798,047 Pre-molded leadframe 5 2002
6,777,789 Mounting for a package containing a chip 6 2003
6,965,159 Reinforced lead-frame assembly for interconnecting circuits within a circuit module 4 2003
6,750,545 Semiconductor package capable of die stacking 13 2003
6,794,740 Leadframe package for semiconductor devices 4 2003
7,095,103 Leadframe based memory card 0 2003
6,879,034 Semiconductor package including low temperature co-fired ceramic substrate 4 2003
7,045,396 Stackable semiconductor package and method for manufacturing same 75 2003
7,008,825 Leadframe strip having enhanced testability 22 2003
6,876,068 Semiconductor package with increased number of input and output pins 44 2003
7,183,630 Lead frame with plated end leads 7 2003
6,897,550 Fully-molded leadframe stand-off feature 3 2003
7,485,952 Drop resistant bumpers for fully molded memory cards 0 2003
6,873,032 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 11 2003
6,873,041 Power semiconductor package with strap 16 2003
7,071,541 Plastic integrated circuit package and method and leadframe for making the package 1 2003
7,245,007 Exposed lead interposer leadframe package 43 2003
7,057,280 Leadframe having lead locks to secure leads to encapsulant 4 2003
6,921,967 Reinforced die pad support structure 4 2003
6,998,702 Front edge chamfer feature for fully-molded memory cards 7 2003
6,846,704 Semiconductor package and method for manufacturing the same 10 2003
6,967,395 Mounting for a package containing a chip 12 2003
6,893,900 Method of making an integrated circuit package 1 2003
7,138,707 Semiconductor package including leads and conductive posts for providing increased functionality 5 2003
7,144,517 Manufacturing method for leadframe and for semiconductor package using the leadframe 3 2003
7,211,879 Semiconductor package with chamfered corners and method of manufacturing the same 4 2003
6,965,157 Semiconductor package with exposed die pad and body-locking leadframe 9 2003
7,115,445 Semiconductor package having reduced thickness 1 2004
7,057,268 Cavity case with clip/plug for use on multi-media card 3 2004
7,091,594 Leadframe type semiconductor package having reduced inductance and its manufacturing method 7 2004
7,170,150 Lead frame for semiconductor package 2 2004
6,844,615 Leadframe package for semiconductor devices 7 2004
7,005,326 Method of making an integrated circuit package 5 2004
7,190,062 Embedded leadframe semiconductor package 24 2004
7,211,471 Exposed lead QFP package fabricated through the use of a partial saw process 42 2004
7,598,598 Offset etched corner leads for semiconductor package 0 2004
7,202,554 Semiconductor package and its manufacturing method 14 2004
7,045,882 Semiconductor package including flip chip 7 2004
6,953,988 Semiconductor package 18 2004
7,217,991 Fan-in leadframe semiconductor package 7 2004
7,253,503 Integrated circuit device packages and substrates for making the packages 41 2004
7,001,799 Method of making a leadframe for semiconductor devices 2 2004
7,064,009 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 7 2004
7,030,474 Plastic integrated circuit package and method and leadframe for making the package 2 2004
7,214,326 Increased capacity leadframe and semiconductor package using the same 4 2005
7,247,523 Two-sided wafer escape package 15 2005
6,995,459 Semiconductor package with increased number of input and output pins 49 2005
7,192,807 Wafer level package and fabrication method 17 2005
7,045,883 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 5 2005
7,507,603 Etch singulated semiconductor package 8 2005
7,361,533 Stacked embedded leadframe 20 2005
7,572,681 Embedded electronic component package 19 2005
7,112,474 Method of making an integrated circuit package 1 2005
7,564,122 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant 1 2006
8,410,585 Leadframe and semiconductor package made using the leadframe 0 2006
7,535,085 Semiconductor package having improved adhesiveness and ground bonding 2 2006
7,902,660 Substrate for semiconductor device and manufacturing method thereof 15 2006
7,968,998 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package 2 2006
7,321,162 Semiconductor package having reduced thickness 0 2006
7,332,375 Method of making an integrated circuit package 0 2006
7,521,294 Lead frame for semiconductor package 5 2006
7,714,431 Electronic component package comprising fan-out and fan-in traces 20 2006
7,687,893 Semiconductor package having leadframe with exposed anchor pads 3 2006
7,829,990 Stackable semiconductor package including laminate interposer 1 2007
7,982,297 Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same 1 2007
7,420,272 Two-sided wafer escape package 16 2007
7,723,210 Direct-write wafer level chip scale package 6 2007
7,687,899 Dual laminate package structure with embedded elements 5 2007
7,777,351 Thin stacked interposer package 23 2007
8,089,159 Semiconductor package with increased I/O density and method of making the same 0 2007
7,847,386 Reduced size stacked semiconductor package and method of making the same 0 2007
7,560,804 Integrated circuit package and method of making the same 1 2008
7,956,453 Semiconductor package with patterning layer and method of making same 0 2008
7,723,852 Stacked semiconductor package and method of making same 4 2008
8,067,821 Flat semiconductor package with half package molding 2 2008
7,768,135 Semiconductor package with fast power-up cycle and method of making same 3 2008
7,808,084 Semiconductor package with half-etched locking features 1 2008
8,125,064 Increased I/O semiconductor package and method of making same 0 2008
8,184,453 Increased capacity semiconductor package 1 2008
7,692,286 Two-sided fan-out wafer escape package 20 2008
7,847,392 Semiconductor device including leadframe with increased I/O 5 2008
7,989,933 Increased I/O leadframe and semiconductor device including same 1 2008
8,008,758 Semiconductor device with increased I/O leadframe 3 2008
8,089,145 Semiconductor device including increased capacity leadframe 1 2008
8,072,050 Semiconductor device with increased I/O leadframe including passive device 0 2008
7,875,963 Semiconductor device including leadframe having power bars and increased I/O 3 2008
7,982,298 Package in package semiconductor device 1 2008
8,058,715 Package in package device for RF transceiver module 1 2009
7,732,899 Etch singulated semiconductor package 0 2009
8,026,589 Reduced profile stackable semiconductor package 4 2009
7,960,818 Conformal shield on punch QFN semiconductor package 0 2009
7,928,542 Lead frame for semiconductor package 1 2009
7,977,163 Embedded electronic component package fabrication method 2 2009
8,089,141 Semiconductor package having leadframe with exposed anchor pads 0 2010
7,872,343 Dual laminate package structure with embedded elements 1 2010
8,188,584 Direct-write wafer level chip scale package 0 2010
7,932,595 Electronic component package comprising fan-out traces 4 2010
8,324,511 Through via nub reveal method and structure 0 2010
7,906,855 Stacked semiconductor package and method of making same 1 2010
8,294,276 Semiconductor device and fabricating method thereof 0 2010
8,084,868 Semiconductor package with fast power-up cycle and method of making same 0 2010
8,319,338 Thin stacked interposer package 0 2010
8,299,602 Semiconductor device including leadframe with increased I/O 0 2010
8,283,767 Dual laminate package structure with embedded elements 0 2010
8,188,579 Semiconductor device including leadframe having power bars and increased I/O 1 2010
8,390,130 Through via recessed reveal structure and method 0 2011
8,318,287 Integrated circuit package and method of making the same 0 2011
8,102,037 Leadframe for semiconductor package 0 2011
8,119,455 Wafer level package fabrication method 1 2011
8,304,866 Fusion quad flat semiconductor package 0 2011
8,432,023 Increased I/O leadframe and semiconductor device including same 0 2011
8,227,921 Semiconductor package with increased I/O density and method of making same 0 2011
8,298,866 Wafer level package and fabrication method 0 2012
 
MICRON TECHNOLOGY, INC. (14)
6,475,831 Methods for a low profile multi-IC chip package connector 5 2001
6,650,007 Stackable ceramic fbga for high thermal applications 16 2001
6,486,546 Low profile multi-IC chip package connector 13 2002
6,773,955 Low profile multi-IC chip package connector 6 2002
6,686,655 Low profile multi-IC chip package connector 5 2002
6,858,926 Stackable ceramic FBGA for high thermal applications 10 2003
7,285,442 Stackable ceramic FBGA for high thermal applications 5 2005
7,799,610 Method of fabricating a stacked die having a recess in a die BGA package 3 2007
7,829,991 Stackable ceramic FBGA for high thermal applications 2 2007
7,575,953 Stacked die with a recess in a die BGA package 2 2007
8,373,277 Stacked die in die BGA package 0 2008
8,072,082 Pre-encapsulated cavity interposer 1 2008
8,111,515 Methods and apparatuses for transferring heat from stacked microfeature devices 2 2009
8,399,297 Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packages 0 2011
 
INTEL CORPORATION (8)
7,132,311 Encapsulation of a stack of semiconductor dice 15 2002
6,927,497 Multi-die semiconductor package 5 2002
7,145,249 Semiconducting device with folded interposer 7 2004
7,378,725 Semiconducting device with stacked dice 3 2004
7,132,739 Encapsulated stack of dice and support therefor 3 2004
7,498,201 Method of forming a multi-die semiconductor package 1 2005
7,482,698 Semiconducting device with folded interposer 0 2006
7,456,048 Semiconducting device with folded interposer 0 2006
 
STATS CHIPPAC LTD. (3)
7,863,755 Package-on-package system with via Z-interconnections 1 2008
8,119,447 Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof 1 2009
8,258,008 Package-on-package system with via z-interconnections and method for manufacturing thereof 0 2010
 
HYNIX SEMICONDUCTOR INC. (1)
7,462,508 Stack type semiconductor package module utilizing solder coated stacking protrusions and method for manufacturing the same 1 2007
 
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (1)
7,091,592 Stacked package for electronic elements and packaging method thereof 9 2004
 
KABUSHIKI KAISHA TOSHIBA (1)
7,087,988 Semiconductor packaging apparatus 8 2002
 
RENESAS TECHNOLOGY CORP. (1)
6,670,701 Semiconductor module and electronic component 7 2001
 
SAMSUNG ELECTRONICS CO., LTD. (1)
7,786,573 Packaging chip having interconnection electrodes directly connected to plural wafers 5 2006
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
6,414,381 Interposer for separating stacked semiconductor chips mounted on a multi-layer printed circuit board 74 2000
 
SUN MICROSYSTEMS, INC. (1)
7,067,910 Method and apparatus for using capacitively coupled communication within stacks of laminated chips 8 2004
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (2)
8,440,554 Through via connected backside embedded circuit features structure and method 0 2010
8,441,110 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package 0 2011

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